Automotive Electronics is a critical component in modern vehicles, enabling advanced features and enhancing driving safety and comfort. Among its key areas is ADAS (Advanced Driver Assistance Systems) and Autonomous Driving, which rely on various technologies to assist drivers and eventually achieve full vehicle autonomy. A vital part of these systems is LiDAR (Light Detection and Ranging), which uses laser technology to create precise 3D maps of the vehicle's surroundings, improving object detection and navigation accuracy. To ensure seamless communication between LiDAR sensors and other vehicle systems, Interface ICs (Integrated Circuits) play an essential role. These chips manage data transfer, signal processing, and power management, ensuring reliable and efficient operation. LiDAR Systems with compatible Interface ICs are widely used in autonomous vehicles, adaptive cruise control, lane-keeping assistance, and collision avoidance systems. They enable real-time environmental awareness, making driving safer and more intelligent. The integration of these technologies is crucial for the development of next-generation vehicles, supporting both driver assistance and fully autonomous capabilities. By combining LiDAR with robust Interface ICs, automotive electronics continues to evolve, offering enhanced performance, reliability, and scalability for future mobility solutions.
Series Name | Description | Manufacturer Name | Attribute Description |
---|---|---|---|
Microchip Technology | 5V high-side power switch, 200mA max load current, over-temperature and over-current protection, enable input compatible with 3.3V/5V logic, ultra-low quiescent current. | ||
Microchip Technology | 5V tolerant CAN FD transceiver, 8 Mbps data rate, ISO 11898-2 compliant, operates from -40°C to +125°C, supports 3.3V and 5V MCU interfaces, low-power standby mode, high EMI immunity, integrated fault protection. | ||
Microchip Technology | High-speed CAN transceiver with data rates up to 5 Mbps, operating voltage 4.5V to 5.5V, supports ISO 11898-2, low EMI, high EMC performance, and thermal shutdown protection. | ||
Microchip Technology | 10/100 Ethernet PHY, 48-pin, SPI/MIIM interface, low power, AEC-Q100 qualified, supports MII/RMII, integrated termination, -40°C to +125°C operating temperature, 3.3V/2.5V supply. | ||
Microchip Technology | 16-bit, 500 kSPS, differential input, low-power ADC with SPI interface, INL ±2 LSB, operating voltage 2.7V to 5.5V, available in 10-pin MSOP package. | ||
onsemi | 3.3V LVDS 4-channel Mux/Repeater, 2.5 Gbps per channel, low jitter, 1.8V/2.5V/3.3V supply, 32-pin QFN, industrial temperature range. | ||
Texas Instruments | 3-phase sensorless BLDC motor driver, 6.5V to 16V supply, up to 2A peak output current, integrated MOSFETs, PWM control, supports 12V/24V systems, I²C interface, low-noise commutation, AEC-Q100 qualified. | ||
Texas Instruments | 10/100 Mbps Ethernet PHY, 3.3V supply, low power, integrated signal transformers, IEEE 1149.1 JTAG, MII/RMII interface, -40°C to 85°C operating temperature, 32-pin WQFN package. | ||
Texas Instruments | 24-bit ADC, 4 programmable current sinks, integrated DSP, supports capacitive and resistive sensing, 1.8V/3.3V operation, SPI interface, -40°C to 125°C temperature range, optimized for automotive pressure sensing applications. | ||
Texas Instruments | Ultrasonic signal processor, 2.3V to 5.5V supply, integrated transducer drivers, time-of-flight measurement, echo processing, UART/SPI interface, programmable gain amplifier, 16-pin HTSSOP package, operating temp -40°C to 125°C. |