The Digital Cluster / Connected Dashboard is an advanced automotive electronic system designed for electric two-wheelers, enhancing rider experience through real-time information display and connectivity. It serves as the central interface between the rider and the vehicle, offering essential data such as speed, battery status, navigation, and system diagnostics. This system integrates seamlessly with the vehicle’s control units, providing a unified and intuitive user experience.
Designed for modern mobility solutions, the Digital Cluster / Connected Dashboard supports features like smartphone integration, Bluetooth connectivity, and over-the-air (OTA) updates. These capabilities allow riders to stay connected, monitor vehicle performance, and receive software improvements without visiting a service center. The dashboard also enhances safety by displaying critical alerts and warnings in real time.
This system is widely used in electric scooters and motorcycles, where compact design and high functionality are essential. It caters to urban commuters seeking efficient, smart, and eco-friendly transportation options. By combining digital display technology with connectivity features, the Digital Cluster / Connected Dashboard represents a key innovation in the evolution of electric two-wheeler systems. It not only improves usability but also aligns with the growing demand for intelligent, connected vehicles in the automotive industry.

| Series Name | Description | Manufacturer Name | Attribute Description |
|---|---|---|---|
| NXP Semiconductors | 32-bit ARM Cortex-M4F MCU, 180 MHz, 1 MB Flash, 256 KB SRAM, USB 2.0, CAN FD, 12-bit ADC, QFP100 package, operating temp -40°C to +105°C. | ||
| NXP Semiconductors | Cortex-M7 + Cortex-M4 dual-core, up to 1 GHz, 2 MB SRAM, 800 MHz Octal SPI, 2x CAN FD, 2x USB, 10/100 Ethernet, LCD, camera, PCIe, advanced security | ||
| NXP Semiconductors | 32-bit ARM Cortex-M4F MCU, 180 MHz, 1 MB Flash, 256 KB SRAM, USB 2.0, CAN FD, 12-bit ADC, QFP100 package, operating temp -40°C to +105°C. | ||
| NXP Semiconductors | Quad-core ARM Cortex-A53, up to 1.8 GHz; Cortex-M7 coprocessor; Mali-GPU; 8K video decode; LPDDR4, DDR4, LPDDR3; PCIe, USB 3.0, MIPI-CSI, MIPI-DSI; industrial temp range. | ||
| NXP Semiconductors | Dual-channel power manager with I²C interface, supports buck-boost conversion, 2.7V to 5.5V input, 9 programmable output voltages, 1.8A max current per channel, 1MHz switching frequency, 16-pin QFN package. | ||
| NXP Semiconductors | Cortex-A55 up to 1.7 GHz, Cortex-M33, 2D/3D GPU, 8-bit LPDDR4/LPDDR4X, 8/16-bit LPDDR5, 1x CAN FD, 4x I3C, 4x USB 2.0, 2x 10/100/1000 Ethernet, security enabler. | ||
| Renesas Electronics Corporation | ARM Cortex-M33 core, 256 KB RAM, 1 MB Flash, Bluetooth 5.3, 2.4 GHz RF, QFN48 package, -40°C to +85°C, 1.71–3.6 V operation, integrated DC/DC converter, multiple peripherals including UART, SPI, I2C, ADC, and GPIO. | ||
| Renesas Electronics Corporation | 1.8V to 5.5V supply voltage; 1.8V logic I/O; 32.768kHz oscillator; low-power mode with 300nA current; integrated LDO; I2C interface; 4-pin WLCSP package; operating temperature -40°C to +85°C. | ||
| Renesas Electronics Corporation | 24-bit stereo audio codec, 8 kHz to 96 kHz sample rates, low power consumption, integrated PLL, I²S/PCM interface, stereo ADC/DAC, headphone amplifier, I²C control, flexible routing and mixing. |