Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.
| Part # | Manufacturer | Description | Availability | Pricing | Quantity |
|---|---|---|---|---|---|
MIKROE-302Adapter, Breakout Boards | MikroElektronika | SOIC-SOP-8 TO DIP8-300MIL ADAPTE | 10 | - | |
MIKROE-303Adapter, Breakout Boards | MikroElektronika | TSSOP-SSOP-8 TO DIP8-300MIL ADAP | 8 | - | |
MIKROE-305Adapter, Breakout Boards | MikroElektronika | TSSOP-SSOP-16 TO DIP16-300MIL AD | 3 | - | |
MIKROE-308Adapter, Breakout Boards | MikroElektronika | TSSOP-SSOP-24 TO DIP24-300MIL AD | 1 | - | |
MIKROE-310Adapter, Breakout Boards | MikroElektronika | TSSOP-SSOP-28 TO DIP28-600MIL AD | 7 | - |