Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.
| Part # | Manufacturer | Description | Availability | Pricing | Quantity |
|---|---|---|---|---|---|
0372504040Heat Sinks | Molex | CHIPSET COOLER CU #1 6500 RPM | In Stock | - | |
0372505020Heat Sinks | Molex | CHIPSET COOLER #2 COPPER 6500RPM | In Stock | - | |
0372501020Heat Sinks | Molex | CHIP-SET COOLER #1 ALUMINUM 6500 | In Stock | - | |
0372503020Heat Sinks | Molex | CHIP-SET COOLER #3 ALUMINUM 6500 | In Stock | - | |
0747500303Heat Sinks | Molex | CONN HEAT SINK FOR QSFP+ CAGE | In Stock | - | |
74750-0308Heat Sinks | Molex | Quad Small Form-Factor Pluggable Plus (QSFP) Heat Sink | 1520 | - | |
74750-0319Heat Sinks | Molex | Custom QSFP Heat Sink Low Profile Heat Sink | 200 | - |