ADLINK Technology
I-COM-HPC-SIDH-2796-X557 DEV KIT
48-I-COM-HPC-SIDH-2796-X557 DEV KIT
ADLINK Technology COM-HPC Intel Ice Lake-D HCC development kit with D-2796 CPU module, with carrier, X557 OCP, heatsink and accessories
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I-COM-HPC-SIDH-2796-X557 DEV KIT Description
ADLINK Technology COM-HPC Intel Ice Lake-D HCC development kit with D-2796 CPU module, with carrier, X557 OCP, heatsink and accessories
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I-COM-HPC-SIDH-2796-X557 DEV KIT is a Unclassified from ADLINK Technology. This product page provides its main specifications, pricing information, availability, and inquiry options.
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