Alliance Memory, Inc.
AS4C128M16D3B-12BCNTR

774-AS4C128M16D3B-12BCNTR
PDF Datasheet
IC DRAM 2GBIT PARALLEL 96FBGA

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Tech Specifications

Clock Frequency
800 MHz
Memory Type
Volatile
Product Status
Obsolete
Supplier Device Package
96-FBGA (8x13)
Access Time
20 ns
Package / Case
96-VFBGA
Technology
SDRAM - DDR3
Voltage - Supply
1.425V ~ 1.575V
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AS4C128M16D3B-12BCNTR Description

AS4C128M16D3B-12BCNTR Description

The AS4C128M16D3B-12BCNTR is a high-performance, 2Gbit DRAM memory IC chip manufactured by Alliance Memory, Inc. This device is designed to deliver exceptional performance and reliability, making it suitable for a wide range of applications that require fast and efficient data storage and retrieval. The AS4C128M16D3B-12BCNTR features a parallel memory interface and is housed in a 96FBGA package, ensuring compatibility with various modern electronic systems.

AS4C128M16D3B-12BCNTR Features

  • Memory Organization: The AS4C128M16D3B-12BCNTR is organized as 128M x 16, providing a total memory size of 2Gbit. This organization allows for efficient data management and high-speed access.
  • Clock Frequency: With a clock frequency of 800 MHz, this DRAM IC ensures rapid data processing and transfer, making it ideal for applications requiring high-speed performance.
  • Access Time: The access time of 20 ns ensures quick data retrieval, enhancing overall system performance.
  • Write Cycle Time: The write cycle time of 15 ns for both word and page operations ensures efficient data writing capabilities.
  • Voltage - Supply: The device operates within a supply voltage range of 1.425V to 1.575V, providing flexibility and ensuring compatibility with various power supply configurations.
  • Operating Temperature: The AS4C128M16D3B-12BCNTR is designed to operate within a temperature range of 0°C to 95°C, making it suitable for a variety of environmental conditions.
  • Moisture Sensitivity Level (MSL): With an MSL of 3 (168 Hours), the device is well-suited for manufacturing processes that require extended exposure to moisture.
  • Compliance: The AS4C128M16D3B-12BCNTR is REACH unaffected and ROHS3 compliant, ensuring it meets the latest environmental and safety standards.
  • Packaging: The device is available in a Tape & Reel (TR) package, facilitating easy handling and integration into automated assembly processes.

AS4C128M16D3B-12BCNTR Applications

The AS4C128M16D3B-12BCNTR is ideal for applications that demand high-speed, high-density memory solutions. Some specific use cases include:

  • Networking Equipment: Ideal for routers, switches, and other networking devices that require fast data access and processing.
  • Telecommunications: Suitable for base stations and other telecommunication infrastructure that need reliable and high-speed memory.
  • Industrial Control Systems: Applicable in industrial automation and control systems where rapid data handling is crucial.
  • Embedded Systems: Perfect for embedded systems in various industries, including automotive, aerospace, and medical devices, where high-performance memory is essential.

Conclusion of AS4C128M16D3B-12BCNTR

The AS4C128M16D3B-12BCNTR is a robust and high-performance DRAM memory IC chip that offers significant advantages over similar models. Its fast access and write cycle times, combined with its high clock frequency and wide operating temperature range, make it a versatile and reliable choice for a variety of applications. Despite its obsolete product status, the AS4C128M16D3B-12BCNTR remains a valuable component for systems that require high-speed, high-density memory solutions. Its compliance with environmental and safety standards further enhances its appeal in the electronics industry.

FAQ

What is the mounting type of AS4C128M16D3B-12BCNTR?
AS4C128M16D3B-12BCNTR uses a Surface Mount mounting style based on the listed product specifications.
Is AS4C128M16D3B-12BCNTR currently in stock?
What voltage specification is listed for AS4C128M16D3B-12BCNTR?
What is AS4C128M16D3B-12BCNTR?
What operating temperature range does AS4C128M16D3B-12BCNTR support?
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