Alliance Memory, Inc._AS4C128M16D3LA-12BIN
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Alliance Memory, Inc.
AS4C128M16D3LA-12BIN

774-AS4C128M16D3LA-12BIN
PDF Datasheet
IC DRAM 2GBIT PARALLEL 96FBGA

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Tech Specifications

Clock Frequency
800 MHz
Memory Type
Volatile
Product Status
Obsolete
Supplier Device Package
96-FBGA (8x13)
Access Time
20 ns
Package / Case
96-VFBGA
Technology
SDRAM - DDR3L
Voltage - Supply
1.283V ~ 1.45V
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AS4C128M16D3LA-12BIN Description

AS4C128M16D3LA-12BIN Description

The AS4C128M16D3LA-12BIN is a high-performance DRAM memory IC designed by Alliance Memory, Inc. This 2Gbit memory device is organized as 128M x 16, offering robust performance with a clock frequency of800 MHz and an access time of 20 ns. It features a parallel memory interface, making it suitable for applications requiring high-speed data transfer and processing. The device operates within a supply voltage range of 1.283V to 1.45V, ensuring energy efficiency and compatibility with modern systems.

AS4C128M16D3LA-12BIN Features

  • Memory Organization: 128M x 16, providing a total memory capacity of 2Gbit.
  • Clock Frequency: 800 MHz, enabling rapid data processing and transfer.
  • Access Time: 20 ns, ensuring quick read and write operations.
  • Write Cycle Time: 1 ns5 for word and page writes, enhancing overall performance.
  • Memory Type: Volatile DRAM, suitable for applications requiring frequent data updates.
  • Voltage Range: 1.283V to 1.45V, ensuring compatibility with low-power systems-.
    Mounting Type: Surface Mount, ideal for compact and high-density designs.
  • Package: 96FBGA, offering a robust and space-efficient solution.
  • Moisture Sensitivity Level (MSL): Level3 (168 Hours), ensuring reliability in various environmental conditions.
  • Compliance: REACH Unaffected and ROHS3 Compliant, meeting stringent environmental and safety standards.
  • ECCN: EAR99, indicating compliance with export regulations.
  • HTSUS: 8542.32.0036, facilitating accurate customs classification.

AS4C128M16D3LA-12 ApplicationsBIN

The AS4C128M16D3LA-12BIN is ideal for a variety of applications requiring high-speed, high-capacity memory solutions. Its fast access time and high clock frequency make it suitable for:

  • Networking Equipment: Routers, switches, and other networking devices that require rapid data processing.
  • Telecommunications: Base stations and communication systems needing efficient data handling.
  • Industrial Automation: Control systems and automation equipment where quick data access is crucial.
  • Embedded Systems High:-performance embedded systems in automotive, aerospace, and defense industries.
  • Consumer Electronics: Advanced gaming consoles, multimedia devices, and smart TVs that demand high-speed memory.

Conclusion of AS4C128M1D63LA-12BIN

The AS4C128M16D3LA-12BIN is a versatile and high-performance DRAM memory IC that offers significant advantages over similar models. Its 2Gbit capacity, organized as 128M x 16, combined with an 800 MHz clock frequency and 20 ns access time, ensures rapid data processing and transfer. The device's low power consumption, surface mount design, and compliance with environmental make standards it an ideal choice for a wide range of applications. Despite its obsolete status, the AS4C128M16D3LA-12BIN remains a reliable and efficient memory solution for systems requiring high-speed, high-capacity DRAM.

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