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AS4C128M16D3LB-12BIN

AS4C128M16D3LB-12BIN Description

The AS4C128M16D3LB-12BIN is a high-performance, 2Gbit DRAM memory IC chip manufactured by Alliance Memory, Inc. This chip features a parallel memory interface and is designed for surface mount applications. It operates at a clock frequency of 800 MHz and offers an access time of 20 ns, making it suitable for demanding applications requiring fast data retrieval. The memory is organized as 128M x 16, providing a robust memory structure for various computing needs. The AS4C128M16D3LB-12BIN operates within a supply voltage range of 1.283V to 1.45V, ensuring efficient power usage. It is packaged in a 96BGA format and is available in tray packaging.

AS4C128M16D3LB-12BIN Features

• Memory Organization: The AS4C128M16D3LB-12BIN features a 128M x 16 memory organization, providing a total memory size of 2Gbit. This configuration ensures that the chip can handle large volumes of data efficiently.
• High-Speed Performance: With a clock frequency of 800 MHz and an access time of 20 ns, this DRAM chip delivers rapid data access and processing capabilities. The write cycle time of 15 ns further enhances its performance.
• Power Efficiency: The chip operates within a voltage range of 1.283V to 1.45V, ensuring low power consumption and efficient energy use.
• Compliance and Safety: The AS4C128M16D3LB-12BIN is REACH unaffected and RoHS3 compliant, making it suitable for environmentally conscious applications. It also has a moisture sensitivity level (MSL) of 3 (168 hours), ensuring reliability in various environmental conditions.
• Mounting and Packaging: The surface mount technology (SMT) and 96BGA package format make it ideal for compact and high-density PCB designs. The tray packaging ensures safe handling and storage.

AS4C128M16D3LB-12BIN Applications

The AS4C128M16D3LB-12BIN is well-suited for a variety of high-performance computing applications where fast data access and processing are critical. Some specific use cases include:

• Networking Equipment: Ideal for routers, switches, and other networking devices that require rapid data handling and processing.
• Telecommunications: Suitable for base stations and other telecom equipment where high-speed data transfer and storage are essential.
• Industrial Control Systems: Applicable in industrial automation and control systems that demand reliable and fast memory solutions.
• Consumer Electronics: Can be used in high-end consumer electronics such as gaming consoles, smart TVs, and multimedia devices.

Conclusion of AS4C128M16D3LB-12BIN

The AS4C128M16D3LB-12BIN is a high-performance DRAM memory IC chip that offers significant advantages over similar models. Its 800 MHz clock frequency, 20 ns access time, and 15 ns write cycle time make it a standout choice for applications requiring rapid data processing. The 128M x 16 memory organization and 2Gbit memory size provide ample storage capacity, while the 1.283V to 1.45V supply voltage ensures efficient power usage. The chip's compliance with REACH and RoHS3 standards, along with its MSL 3 rating, ensures reliability and environmental safety. The surface mount technology and 96BGA package format make it ideal for compact and high-density PCB designs. Despite being marked as obsolete, the AS4C128M16D3LB-12BIN remains a robust and reliable option for various high-performance applications in the electronics industry.