Alliance Memory, Inc._AS4C128M16MD2A-25BIN
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Alliance Memory, Inc.
AS4C128M16MD2A-25BIN

774-AS4C128M16MD2A-25BIN
PDF Datasheet
IC DRAM 2GBIT PARALLEL 134FBGA
20 Weeks

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Tech Specifications

Clock Frequency
400 MHz
Operating Temperature
-40°C ~ 85°C (TC)
Memory Interface
Parallel
ECCN
EAR99
Memory Organization
128M x 16
Mounting Type
Surface Mount
Memory Type
Volatile
Product Status
Active
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AS4C128M16MD2A-25BIN Description

AS4C128M16MD2A-25BIN Description

The AS4C128M16MD2A-25BIN is a high-performance, 2Gbit DRAM memory IC chip designed for demanding applications requiring fast data access and large memory capacity. Manufactured by Alliance Memory, Inc., this chip features a parallel memory interface and a clock frequency of 400 MHz, ensuring rapid data transfer rates. The memory organization is 128M x 16, providing a substantial amount of memory in a compact form factor. This device is ideal for applications that require high-speed, volatile memory solutions.

AS4C128M16MD2A-25BIN Features

  • High-Speed Performance: With a clock frequency of 400 MHz, the AS4C128M16MD2A-25BIN delivers fast data access times, making it suitable for high-speed computing and data-intensive applications.
  • Parallel Memory Interface: The parallel memory interface ensures efficient data transfer, maintaining high throughput and reducing latency.
  • Volatile Memory: As a volatile DRAM, it provides fast read and write cycles, with a write cycle time of 15ns, essential for applications requiring quick data processing.
  • Wide Voltage Range: The AS4C128M16MD2A-25BIN operates within a voltage range of 1.14V to 1.95V, offering flexibility and compatibility with various power supply configurations.
  • Surface Mount Technology: The surface mount mounting type allows for easy integration into modern PCB designs, ensuring reliable and compact installations.
  • Compliance and Reliability: The device is REACH unaffected and RoHS3 compliant, meeting stringent environmental and safety standards. It also has a moisture sensitivity level (MSL) of 3, ensuring reliability in various environmental conditions.
  • Packaging: Supplied in a tray package, the AS4C128M16MD2A-25BIN is easy to handle and store, reducing the risk of damage during transportation and assembly.

AS4C128M16MD2A-25BIN Applications

The AS4C128M16MD2A-25BIN is well-suited for a variety of applications that demand high-speed, high-capacity memory solutions. Some specific use cases include:

  • High-Performance Computing: Ideal for servers and workstations requiring large amounts of fast-access memory to handle complex computations and data processing tasks.
  • Networking Equipment: Suitable for routers and switches that need rapid data transfer and storage capabilities to manage high-speed network traffic.
  • Embedded Systems: Can be used in embedded systems where fast memory access is crucial for real-time processing and data handling.
  • Consumer Electronics: Applicable in devices such as gaming consoles and high-end multimedia systems that require quick and efficient memory access for smooth performance.

Conclusion of AS4C128M16MD2A-25BIN

The AS4C128M16MD2A-25BIN from Alliance Memory, Inc. is a robust and versatile DRAM memory IC chip that offers high-speed performance and substantial memory capacity. Its parallel memory interface and wide voltage range make it adaptable to various applications, while its compliance with environmental and safety standards ensures reliability and sustainability. Whether used in high-performance computing, networking equipment, embedded systems, or consumer electronics, the AS4C128M16MD2A-25BIN provides a reliable and efficient memory solution that meets the demands of modern electronics.

FAQ

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The standard lead time for AS4C128M16MD2A-25BIN is 20 Weeks.
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