Alliance Memory, Inc._AS4C16M16S-6BIN
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Alliance Memory, Inc.
AS4C16M16S-6BIN

774-AS4C16M16S-6BIN
PDF Datasheet
IC DRAM 256MBIT PAR 54TFBGA

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Tech Specifications

Clock Frequency
166 MHz
Memory Type
Volatile
Product Status
Obsolete
Supplier Device Package
54-TFBGA (8x8)
Access Time
5.4 ns
Package / Case
54-TFBGA
Technology
SDRAM
Voltage - Supply
3V ~ 3.6V
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AS4C16M16S-6BIN Description

AS4C16M16S-6BIN Description

The AS4C16M16S-6BIN is a high-performance Synchronous DRAM (SDRAM) IC designed by Alliance Memory, Inc. This memory module features a 16M x 16 memory organization, providing a total memory size of 256 Mbit. It operates with a clock frequency of 166 MHz and offers an access time of 5.4 ns, ensuring rapid data retrieval and processing. The memory is volatile, meaning it requires a continuous power supply to retain data, and it operates within a voltage range of 3V to 3.6V. The AS4C16M16S-6BIN is housed in a 54-TFBGA package, suitable for surface-mount applications, and is available in tray packaging.

AS4C16M16S-6BIN Features

  • Memory Organization: 16M x 16, providing a total memory size of 256 Mbit.
  • Clock Frequency: 166 MHz, ensuring high-speed data processing.
  • Access Time: 5.4 ns, enabling rapid access to memory.
  • Write Cycle Time: 12 ns for word and page writes.
  • Voltage Supply: 3V to 3.6V, offering flexibility in power supply requirements.
  • Memory Type: Volatile SDRAM, suitable for applications requiring dynamic memory.
  • Technology: SDRAM, providing synchronous data transfer capabilities.
  • Memory Interface: Parallel, allowing for efficient data communication.
  • Mounting Type: Surface Mount, ideal for compact and high-density designs.
  • Moisture Sensitivity Level (MSL): Level 3 (168 Hours), ensuring reliability in various environmental conditions.
  • Compliance: ROHS3 Compliant and REACH Unaffected, meeting industry standards for environmental and safety regulations.
  • Product Status: Obsolete, but still available for legacy systems and specific applications.

AS4C16M16S-6BIN Applications

The AS4C16M16S-6BIN is well-suited for a variety of applications that require high-speed, dynamic memory solutions. Some specific use cases include:

  • Networking Equipment: Routers, switches, and other networking devices that require fast data processing and storage.
  • Telecommunications: Base stations and communication systems that need reliable and high-speed memory.
  • Industrial Control Systems: Real-time control systems that demand quick access to memory for efficient operation.
  • Consumer Electronics: High-performance gaming consoles, multimedia devices, and other consumer electronics that benefit from fast memory access.
  • Embedded Systems: Applications where compact size and high performance are critical, such as automotive electronics and IoT devices.

Conclusion of AS4C16M16S-6BIN

The AS4C16M16S-6BIN from Alliance Memory, Inc. is a robust SDRAM IC designed for high-speed, dynamic memory applications. Its 166 MHz clock frequency and 5.4 ns access time make it an ideal choice for systems requiring rapid data processing. The 256 Mbit memory size and 16M x 16 organization provide ample storage for various applications. The surface-mount 54-TFBGA package ensures compatibility with modern, high-density PCB designs. Despite being marked as obsolete, the AS4C16M16S-6BIN remains a reliable option for legacy systems and specific applications where its performance and features are still highly valued.

FAQ

What voltage specification is listed for AS4C16M16S-6BIN?
The listed voltage-related specification for AS4C16M16S-6BIN is 3V ~ 3.6V.
What operating temperature range does AS4C16M16S-6BIN support?
What is AS4C16M16S-6BIN?
What package or case is AS4C16M16S-6BIN available in?
Are there related or alternative parts for AS4C16M16S-6BIN?
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