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AS4C256M16D3-12BIN

AS4C256M16D3-12BIN Description

The4 ASC256M16D3-12BIN is a high-performance, 4Gbit DRAM memory IC chip manufactured by Alliance Memory, Inc. This chip is designed for applications requiring fast access times and high clock frequencies, making it ideal for modern electronic systems. The AS4C256M16D3-12BIN features a parallel memory interface, which allows for efficient data transfer and processing. It operates within a supply voltage range of 1.425V to 1.575V, ensuring compatibility with a variety of power supply configurations.

The memory organization of the AS4C256M16D3-12BIN is 256M x 16, providing a total memory size of 4Gbit. With an access time of 20ns and a write cycle time of 15ns, this chip offers rapid data read and write capabilities. Its clock frequency of 800 MHz ensures high-speed operation, making it suitable for demanding applications such as high-performance computing and advanced graphics processing.

AS4C256M16D3-12BIN Features

• Memory Type: Volatile DRAM, ensuring data is retained only while power is supplied, which is ideal for systems requiring frequent data updates.
• Access Time: 20ns, providing quick data retrieval and enhancing overall system performance.
• Write Cycle Time: 15ns, allowing for rapid data writing and efficient memory management.
• Clock Frequency: 800 MHz, supporting high-speed operations and ensuring compatibility with modern, high-performance systems.
• Supply Voltage: 1.425V to 1.575V, ensuring flexibility and compatibility with various power supply configurations.
• Memory Organization: 256M x 16, offering a total memory size of 4Gbit, suitable for applications requiring large data storage.
• Mounting Type: Surface Mount, facilitating easy integration into compact and high-density designs.
• Package: 96FBGA, providing a robust and space-efficient packaging solution.
• Moisture Sensitivity Level (MSL): 3 (168 Hours), ensuring reliability and durability in various environmental conditions.
• Compliance: REACH Unaffected and ROHS3 Compliant, meeting stringent environmental and safety standards.
• ECCN: EAR99, indicating compliance with export regulations.
• HTSUS: 8542.32.0036, facilitating accurate customs classification.

AS4C256M16D3-12BIN Applications

The AS4C256M16D3-12BIN is well-suited for a variety of applications due to its high performance and versatile specifications. Some ideal use cases include:

• High-Performance Computing: The fast access times and high clock frequency make it suitable for systems requiring rapid data processing and analysis.
• Advanced Graphics Processing: The large memory size and efficient data transfer capabilities support high-resolution graphics and complex rendering tasks.
• Telecommunications: The robust design and high-speed operation ensure reliable performance in communication infrastructure.
• Industrial Control Systems: The surface mount and compact packaging make it ideal for integration into space-constrained industrial equipment.
• Consumer Electronics: The compliance with environmental and safety standards makes it suitable for use in consumer devices.

Conclusion of AS4C256M16D3-12BIN

The AS4C256M16D3-12BIN is a versatile and high-performance DRAM memory IC chip that offers significant advantages over similar models. Its fast access times, high clock frequency, and large memory size make it ideal for a wide range of applications, from high-performance computing to advanced graphics processing. The surface and mount compact packaging ensure easy integration into modern, space-efficient designs. Compliance with environmental and safety standards further enhances its suitability for various industries. Overall, the AS4C256M16D3-12BIN is a reliable and efficient solution for systems requiring high-speed, high-capacity memory.