Alliance Memory, Inc._AS4C256M16D3LC-12BIN
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Alliance Memory, Inc.
AS4C256M16D3LC-12BIN

774-AS4C256M16D3LC-12BIN
PDF Datasheet
IC DRAM 4GBIT PARALLEL 96FBGA
6 Weeks

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Tech Specifications

Clock Frequency
800 MHz
Memory Type
Volatile
Product Status
Active
Supplier Device Package
96-FBGA (7.5x13.5)
Access Time
20 ns
Package / Case
96-TFBGA
Technology
SDRAM - DDR3L
Voltage - Supply
1.283V ~ 1.45V
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AS4C256M16D3LC-12BIN Description

AS4C256M16D3LC-12BIN Description

The AS4C256M16D3LC-12BIN is a high-performance DRAM memory IC chip designed for demanding applications requiring fast data access and reliable performance. Manufactured by Alliance Memory, Inc., this IC features a 4Gbit memory size organized as 256M x 16, ensuring ample storage capacity for complex data processing tasks. The memory operates with a clock frequency of 800 MHz, providing rapid data transfer rates and efficient system performance. Its volatile memory type ensures that data is retained only while power is supplied, making it suitable for applications where data integrity is crucial during operation.

AS4C256M16D3LC-12BIN Features

  • High-Speed Performance: With an access time of 20 ns and a write cycle time of 15 ns, the AS4C256M16D3LC-12BIN ensures quick data retrieval and storage, making it ideal for high-speed computing environments.
  • Flexible Power Supply: The IC operates within a voltage range of 1.283V to 1.45V, offering flexibility in power management and compatibility with various power supply systems.
  • Compliance and Safety: This product is REACH unaffected and ROHS3 compliant, ensuring it meets stringent environmental and safety standards. Additionally, its moisture sensitivity level (MSL) of 3 (168 hours) makes it suitable for a wide range of manufacturing processes.
  • Parallel Memory Interface: The parallel memory interface allows for efficient data communication with other system components, enhancing overall system performance.
  • Surface Mount Packaging: The surface mount mounting type and 96FBGA package format provide a compact and reliable solution for modern electronic designs, facilitating easy integration into various PCB layouts.

AS4C256M16D3LC-12BIN Applications

The AS4C256M16D3LC-12BIN is well-suited for a variety of applications that demand high-speed, reliable memory solutions. These include:

  • High-Performance Computing: Ideal for servers and workstations that require rapid data processing and large memory capacity.
  • Networking Equipment: Suitable for routers, switches, and other networking devices where fast data transfer and storage are critical.
  • Embedded Systems: Perfect for embedded systems in automotive, industrial, and medical applications that require efficient memory management and high-speed data access.
  • Consumer Electronics: Applicable in high-end consumer electronics such as gaming consoles and smart TVs, where fast memory access enhances user experience.

Conclusion of AS4C256M16D3LC-12BIN

The AS4C256M16D3LC-12BIN from Alliance Memory, Inc. stands out as a robust and versatile DRAM memory IC chip. Its high-speed performance, flexible power supply, and compliance with industry standards make it a reliable choice for a wide range of applications. Whether used in high-performance computing, networking, embedded systems, or consumer electronics, this IC offers significant advantages over similar models, ensuring efficient data processing and storage. Its compact surface mount packaging and parallel memory interface further enhance its appeal, making it an ideal solution for modern electronic designs.

FAQ

What operating temperature range does AS4C256M16D3LC-12BIN support?
AS4C256M16D3LC-12BIN has an operating temperature range of -40°C ~ 95°C (TC).
What is the standard lead time for AS4C256M16D3LC-12BIN?
What is the mounting type of AS4C256M16D3LC-12BIN?
What voltage specification is listed for AS4C256M16D3LC-12BIN?
What is AS4C256M16D3LC-12BIN?
Availability (In Stock : 14 )
Quantity Unit Price Ext. Price
1+ $9.88628 $9.89
10+ $8.50285 $85.03
30+ $7.65772 $229.73
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