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AS4C256M16D4-75BCN

AS4C256M16D4-75BCN Description

The AS4C256M16D4-75BCN is a high-performance DRAM memory IC chip manufactured by Alliance Memory, Inc. This 4Gbit memory device is organized as 256M x 16 and features a parallel memory interface, making it suitable for applications requiring high-speed data transfer and large memory capacity. The IC operates within a supply voltage range of 1.14V to 1.26V and has a clock frequency of 1.333 GHz, ensuring efficient and reliable performance. With an access time of 18 ns and a write cycle time of 15 ns for word and page operations, this DRAM chip delivers rapid data read and write capabilities. The AS4C256M16D4-75BCN is housed in a 96FBGA package and is designed for surface mount applications, providing a compact and robust solution for modern electronic systems. It operates within a temperature range of 0°C to 95°C, making it suitable for various industrial and commercial environments. This memory IC is REACH unaffected and RoHS3 compliant, adhering to stringent environmental and safety standards. The product is available in tray packaging and has a moisture sensitivity level (MSL) of 3 (168 hours), ensuring safe handling and storage.

AS4C256M16D4-75BCN Features

• High-Speed Performance: With a clock frequency of 1.333 GHz and an access time of 18 ns, the AS4C256M16D4-75BCN delivers fast data access and processing capabilities, making it ideal for applications requiring rapid data handling.
• Large Memory Capacity: The 4Gbit memory size, organized as 256M x 16, provides ample storage for complex data sets and applications, ensuring efficient memory management.
• Efficient Power Consumption: Operating within a supply voltage range of 1.14V to 1.26V, this DRAM chip offers low power consumption, making it suitable for energy-efficient designs.
• Reliable Data Transfer: The parallel memory interface ensures high-speed data transfer, enhancing overall system performance and reliability.
• Robust Packaging: The 96FBGA package and surface mount type provide a compact and durable solution, suitable for various electronic systems.
• Wide Operating Temperature Range: The AS4C256M16D4-75BCN operates reliably within a temperature range of 0°C to 95°C, making it suitable for diverse environments.
• Compliance and Safety: The IC is REACH unaffected and RoHS3 compliant, ensuring it meets environmental and safety standards, and has a moisture sensitivity level (MSL) of 3 (168 hours), ensuring safe handling and storage.

AS4C256M16D4-75BCN Applications

The AS4C256M16D4-75BCN is ideal for a variety of applications that require high-speed data processing and large memory capacity. Some specific use cases include:

• Networking Equipment: Ideal for routers, switches, and other networking devices that require fast data transfer and large memory storage for efficient packet processing and routing.
• Telecommunications: Suitable for base stations and other telecommunication infrastructure that need high-speed memory solutions for data handling and processing.
• Industrial Automation: Applicable in industrial control systems and automation equipment where rapid data access and processing are crucial for real-time control and monitoring.
• Consumer Electronics: Can be used in high-performance gaming consoles, multimedia devices, and other consumer electronics that require large memory capacity and fast data processing.
• Embedded Systems: Ideal for embedded systems in various industries, including automotive, aerospace, and medical, where reliability and performance are paramount.

Conclusion of AS4C256M16D4-75BCN

The AS4C256M16D4-75BCN is a high-performance DRAM memory IC chip that offers a combination of large memory capacity, fast data access, and efficient power consumption. Its robust packaging, wide operating temperature range, and compliance with environmental and safety standards make it a reliable choice for a variety of applications. While the product is marked as "Not For New Designs," its unique features and performance benefits make it an attractive option for existing systems and applications that require high-speed, large-capacity memory solutions.