Alliance Memory, Inc._AS4C32M16D2-25BINTR
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Alliance Memory, Inc.
AS4C32M16D2-25BINTR

774-AS4C32M16D2-25BINTR
PDF Datasheet
IC DRAM 512MBIT PAR 84TFBGA

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Tech Specifications

Clock Frequency
400 MHz
Memory Type
Volatile
Product Status
Obsolete
Supplier Device Package
84-TFBGA (8x12.5)
Access Time
400 ps
Package / Case
84-TFBGA
Technology
SDRAM - DDR2
Voltage - Supply
1.7V ~ 1.9V
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AS4C32M16D2-25BINTR Description

AS4C32M16D2-25BINTR Description

The AS4C32M16D2-25BINTR is a high-performance, 512Mbit DRAM memory IC chip manufactured by Alliance Memory, Inc. This chip is designed for applications requiring fast access times and reliable performance. It features a memory organization of 32M x 16, providing a total memory capacity of 512Mbit. The AS4C32M16D2-25BINTR operates with a clock frequency of 400 MHz and offers an access time of just 400 picoseconds, making it suitable for high-speed data processing tasks. The memory is volatile, meaning it requires a continuous power supply to retain data, and operates within a voltage range of 1.7V to 1.9V. The chip is packaged in an 84-pin TFBGA (Thin Fine Pitch Ball Grid Array) format, ideal for surface mount applications. Despite its obsolescence status, the AS4C32M16D2-25BINTR remains a robust choice for specific legacy systems and applications.

AS4C32M16D2-25BINTR Features

  • High-Speed Performance: With a clock frequency of 400 MHz and an access time of 400 picoseconds, the AS4C32M16D2-25BINTR ensures rapid data retrieval and processing, making it suitable for demanding applications.
  • Volatile Memory: As a volatile DRAM, it provides fast read and write capabilities essential for dynamic data storage and retrieval.
  • Wide Operating Voltage Range: The chip operates within a voltage range of 1.7V to 1.9V, offering flexibility in power supply design.
  • Surface Mount Compatibility: The 84TFBGA package is designed for surface mount technology, enabling compact and efficient PCB layouts.
  • Compliance and Safety: The AS4C32M16D2-25BINTR is REACH unaffected and RoHS3 compliant, ensuring it meets environmental and safety standards.
  • Moisture Sensitivity Level: With an MSL of 3 (168 hours), the chip is suitable for manufacturing processes requiring extended exposure to moisture.
  • Parallel Memory Interface: The parallel interface allows for straightforward integration with existing systems and ensures compatibility with a wide range of applications.

AS4C32M16D2-25BINTR Applications

The AS4C32M16D2-25BINTR is ideal for applications that demand high-speed data processing and reliable memory performance. Some specific use cases include:

  • Networking Equipment: High-speed routers and switches benefit from the fast access times and large memory capacity of the AS4C32M16D2-25BINTR.
  • Telecommunications: Base stations and communication hubs require reliable and fast memory solutions to handle large volumes of data.
  • Industrial Control Systems: Real-time control systems and automation equipment can leverage the chip's performance for efficient data management.
  • Legacy Systems: Despite its obsolescence, the AS4C32M16D2-25BINTR remains a viable option for maintaining and upgrading older systems where compatibility is crucial.

Conclusion of AS4C32M16D2-25BINTR

The AS4C32M16D2-25BINTR, manufactured by Alliance Memory, Inc., is a high-performance DRAM memory IC chip that offers significant advantages in terms of speed, reliability, and compatibility. Its fast access times, wide operating voltage range, and surface mount packaging make it a versatile choice for various applications, particularly in networking, telecommunications, and industrial control systems. While the chip is marked as obsolete, its continued availability ensures it remains a reliable option for legacy systems and specific high-speed data processing needs.

FAQ

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