Alliance Memory, Inc._AS4C32M16D2C-25BCN
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Alliance Memory, Inc.
AS4C32M16D2C-25BCN

774-AS4C32M16D2C-25BCN
PDF Datasheet
IC DRAM 512MBIT SSTL 18 84FBGA
6 Weeks

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Tech Specifications

Clock Frequency
400 MHz
Memory Type
Volatile
Product Status
Active
Supplier Device Package
84-FBGA (8x12.5)
Access Time
0.4 ns
Package / Case
84-TFBGA
Technology
SDRAM - DDR2
Voltage - Supply
1.7V ~ 1.9V
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AS4C32M16D2C-25BCN Description

AS4C32M16D2C-25BCN Description

The AS4C32M16D2C-25BCN is a high-performance 512Mbit DRAM memory IC chip manufactured by Alliance Memory, Inc. This memory module is designed for applications requiring fast access times and reliable performance. It features a 32M x 16 memory organization, providing a total memory capacity of 512Mbit. The AS4C32M16D2C-25BCN operates with a clock frequency of 400 MHz and offers an access time of just 0.4 ns, making it ideal for high-speed data processing and storage needs.

AS4C32M16D2C-25BCN Features

  • High-Speed Performance: With a clock frequency of 400 MHz and an access time of 0.4 ns, the AS4C32M16D2C-25BCN ensures rapid data retrieval and processing, crucial for time-sensitive applications.
  • Volatile Memory: As a DRAM device, it provides volatile memory, which means it requires a continuous power supply to retain data. This is ideal for applications where data is frequently read and written.
  • Low Power Consumption: The memory operates within a supply voltage range of 1.7V to 1.9V, contributing to energy efficiency and reduced power consumption.
  • Surface Mount Technology: The AS4C32M16D2C-25BCN is designed for surface mount applications, ensuring compatibility with modern PCB designs and enabling compact system integration.
  • Moisture Sensitivity Level (MSL) 3: This memory IC is rated for MSL 3, allowing for a storage time of 168 hours in a controlled environment, which is suitable for various manufacturing and assembly processes.
  • Operating Temperature Range: The AS4C32M16D2C-25BCN operates within a temperature range of 0°C to 85°C, making it suitable for a wide range of environmental conditions.
  • Compliance and Safety: The memory IC is REACH unaffected and RoHS3 compliant, ensuring it meets stringent environmental and safety standards.
  • Memory Interface: The AS4C32M16D2C-25BCN utilizes the SSTL_18 interface, which is optimized for high-speed data transfer and compatibility with modern memory controllers.

AS4C32M16D2C-25BCN Applications

The AS4C32M16D2C-25BCN is well-suited for a variety of applications that demand high-speed, reliable memory solutions. Some specific use cases include:

  • Networking Equipment: Ideal for routers, switches, and other networking devices that require fast data processing and storage.
  • Telecommunications: Suitable for base stations and other telecommunication infrastructure where high-speed data handling is critical.
  • Industrial Automation: Can be used in industrial control systems and automation equipment that require rapid data access and processing.
  • Consumer Electronics: Applicable in high-end consumer electronics such as gaming consoles and multimedia devices that benefit from fast memory performance.

Conclusion of AS4C32M16D2C-25BCN

The AS4C32M16D2C-25BCN is a robust and high-performance DRAM memory IC that offers significant advantages over similar models. Its fast access times, low power consumption, and compatibility with modern memory interfaces make it a versatile solution for a wide range of applications. Whether used in networking equipment, telecommunications, industrial automation, or consumer electronics, the AS4C32M16D2C-25BCN provides reliable and efficient memory performance, ensuring optimal system operation and data handling.

FAQ

What is the standard lead time for AS4C32M16D2C-25BCN?
The standard lead time for AS4C32M16D2C-25BCN is 6 Weeks.
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What operating temperature range does AS4C32M16D2C-25BCN support?
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