Alliance Memory, Inc._AS4C512M8D3-12BCNTR
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Alliance Memory, Inc.
AS4C512M8D3-12BCNTR

774-AS4C512M8D3-12BCNTR
PDF Datasheet
IC DRAM 4GBIT PARALLEL 78FBGA

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Tech Specifications

Clock Frequency
800 MHz
Memory Type
Volatile
Product Status
Discontinued at Digi-Key
Supplier Device Package
78-FBGA (9x10.5)
Access Time
20 ns
Package / Case
78-TFBGA
Technology
SDRAM - DDR3
Voltage - Supply
1.425V ~ 1.575V
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AS4C512M8D3-12BCNTR Description

AS4C512M8D3-12BCNTR Description

The AS4C512M8D3-12BCNTR is a high-performance, 4Gbit DRAM memory IC chip manufactured by Alliance Memory, Inc. This device is designed to meet the demanding requirements of modern electronic systems, offering a combination of fast access times, low power consumption, and robust performance. The AS4C512M8D3-12BCNTR features a parallel memory interface and is packaged in a 78FBGA format, making it suitable for surface-mount applications. It operates within a supply voltage range of 1.425V to 1.575V and supports a clock frequency of 800 MHz, ensuring efficient data transfer and processing capabilities. The memory is organized as 512M x 8, providing a total memory size of 4Gbit. With an access time of 20 ns and a write cycle time of 15 ns, this DRAM chip delivers rapid data read and write operations, making it ideal for high-speed applications.

AS4C512M8D3-12BCNTR Features

  • High-Speed Performance: The AS4C512M8D3-12BCNTR boasts a clock frequency of 800 MHz and an access time of 20 ns, ensuring rapid data retrieval and processing. The write cycle time of 15 ns further enhances its performance, making it suitable for applications requiring quick data manipulation.
  • Low Power Consumption: Operating within a supply voltage range of 1.425V to 1.575V, this DRAM chip is designed to minimize power usage without compromising performance. This feature is particularly beneficial for battery-powered devices and systems where energy efficiency is crucial.
  • Robust Memory Organization: The memory is organized as 512M x 8, providing a total memory size of 4Gbit. This configuration ensures that the AS4C512M8D3-12BCNTR can handle large volumes of data efficiently, making it ideal for applications requiring substantial memory capacity.
  • Surface-Mount Compatibility: The AS4C512M8D3-12BCNTR is packaged in a 78FBGA format, making it suitable for surface-mount applications. This packaging method ensures easy integration into modern printed circuit boards and supports high-density designs.
  • Wide Operating Temperature Range: The device operates within a temperature range of 0°C to 95°C, making it suitable for a variety of environmental conditions. This wide temperature range ensures reliable performance in both standard and rugged applications.
  • Compliance and Reliability: The AS4C512M8D3-12BCNTR is REACH unaffected and RoHS3 compliant, ensuring that it meets the highest environmental and safety standards. Additionally, its moisture sensitivity level (MSL) of 3 (168 hours) ensures that it can withstand typical manufacturing processes without degradation.

AS4C512M8D3-12BCNTR Applications

The AS4C512M8D3-12BCNTR is ideal for a wide range of applications due to its high-speed performance, low power consumption, and robust memory organization. Some specific use cases include:

  • Networking Equipment: The fast access times and high memory capacity make it suitable for routers, switches, and other networking devices that require rapid data processing and storage.
  • Industrial Control Systems: The wide operating temperature range and surface-mount compatibility ensure that the AS4C512M8D3-12BCNTR can be integrated into industrial control systems, providing reliable performance in harsh environments.
  • Consumer Electronics: The low power consumption and high performance make it an excellent choice for consumer electronics, such as gaming consoles, multimedia devices, and smart TVs, where energy efficiency and speed are critical.
  • Embedded Systems: The AS4C512M8D3-12BCNTR can be used in embedded systems, such as automotive infotainment systems, medical devices, and IoT devices, where compact size and high performance are essential.

Conclusion of AS4C512M8D3-12BCNTR

The AS4C512M8D3-12BCNTR is a high-performance DRAM memory IC chip that offers a combination of fast access times, low power consumption, and robust performance. Its unique features, such as the wide operating temperature range, surface-mount compatibility, and compliance with environmental standards, make it a reliable and versatile solution for a variety of applications. Whether used in networking equipment, industrial control systems, consumer electronics, or embedded systems, the AS4C512M8D3-12BCNTR provides the performance and reliability needed to meet the demands of modern electronic systems.

FAQ

What voltage specification is listed for AS4C512M8D3-12BCNTR?
The listed voltage-related specification for AS4C512M8D3-12BCNTR is 1.425V ~ 1.575V.
What operating temperature range does AS4C512M8D3-12BCNTR support?
Are there related or alternative parts for AS4C512M8D3-12BCNTR?
What is the mounting type of AS4C512M8D3-12BCNTR?
What is AS4C512M8D3-12BCNTR?
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