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AS4C64M16D3L-12BIN

AS4C64M16D3L-12BIN Description

The AS4C64M16D3L-12BIN is a high-performance, 1-Gbit (128M x 8) Synchronous DRAM (SDRAM) IC designed for applications requiring fast data access and high memory density. Manufactured by Alliance Memory, Inc., this memory IC features a parallel interface and operates at a clock frequency of 800 MHz, providing a data transfer rate of up to 1.6 Gbps. The device is organized as 64M x 16, offering a total memory size of 1 Gbit, making it suitable for demanding applications such as high-speed computing and data processing.

The AS4C64M16D3L-12BIN is designed for surface-mount applications and comes in a 96FBGA package, which is ideal for compact and high-density PCB designs. It operates within a supply voltage range of 1.283V to 1.45V, ensuring low power consumption and compatibility with modern power management systems. The memory IC has an access time of 20 ns and a write cycle time of 15 ns, ensuring fast read and write operations.

AS4C64M16D3L-12BIN Features

• High-Speed Performance: With a clock frequency of 800 MHz and an access time of 20 ns, the AS4C64M16D3L-12BIN delivers fast data access, making it suitable for high-speed applications.
• Memory Density: The 1-Gbit memory size, organized as 64M x 16, provides a large storage capacity in a compact form factor.
• Low Power Consumption: The device operates within a supply voltage range of 1.283V to 1.45V, ensuring low power consumption and compatibility with modern power management systems.
• Fast Write Cycle Time: A write cycle time of 15 ns ensures efficient data writing, enhancing overall system performance.
• Parallel Interface: The parallel memory interface allows for straightforward integration with existing systems and ensures compatibility with a wide range of applications.
• Surface-Mount Technology: The 96FBGA package is ideal for compact and high-density PCB designs, making it suitable for space-constrained applications.
• Compliance and Reliability: The AS4C64M16D3L-12BIN is REACH unaffected and RoHS3 compliant, ensuring environmental compliance and reliability in various industrial applications. It also has a moisture sensitivity level (MSL) of 3, allowing for 168 hours of exposure before reflow soldering.

AS4C64M16D3L-12BIN Applications

The AS4C64M16D3L-12BIN is ideal for a variety of applications that require high-speed data access and large memory capacity. Some specific use cases include:

• High-Performance Computing: The fast access times and large memory density make it suitable for applications such as servers, workstations, and high-performance computing systems.
• Networking Equipment: The device can be used in routers, switches, and other networking equipment where fast data transfer and low latency are critical.
• Consumer Electronics: The AS4C64M16D3L-12BIN is also suitable for consumer electronics such as gaming consoles, digital TVs, and set-top boxes, where high-speed memory is required for smooth performance.
• Industrial Systems: The reliability and compliance features make it suitable for industrial control systems, automation equipment, and other applications where environmental compliance and long-term reliability are essential.

Conclusion of AS4C64M16D3L-12BIN

The AS4C64M16D3L-12BIN is a high-performance SDRAM IC that offers a combination of fast data access, large memory density, and low power consumption. Its unique features, such as the 800 MHz clock frequency, 20 ns access time, and 15 ns write cycle time, make it a superior choice over similar models in the market. The device's compliance with environmental standards and its reliability features further enhance its suitability for a wide range of applications, from high-performance computing to consumer electronics and industrial systems. The AS4C64M16D3L-12BIN is an excellent choice for designers looking to integrate a high-speed, high-density memory solution into their systems.