Alliance Memory, Inc._AS4C64M16MD1-6BIN
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Alliance Memory, Inc.
AS4C64M16MD1-6BIN

774-AS4C64M16MD1-6BIN
PDF Datasheet
IC DRAM 1GBIT PARALLEL 60FBGA

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Tech Specifications

Clock Frequency
166 MHz
Memory Type
Volatile
Product Status
Obsolete
Supplier Device Package
60-FBGA (8x10)
Access Time
5 ns
Package / Case
60-TFBGA
Technology
SDRAM - Mobile LPDDR
Voltage - Supply
1.7V ~ 1.95V
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AS4C64M16MD1-6BIN Description

AS4C64M16MD1-6BIN Description

The AS4C64M16MD1-6BIN is a high-performance, 1 Gbit DRAM memory IC chip manufactured by Alliance Memory, Inc. This chip is designed for applications requiring fast access times and reliable performance. It features a parallel memory interface and is organized as 64M x 16, providing a memory size of 1 Gbit. The AS4C64M16MD1-6BIN operates at a clock frequency of 166 MHz and has an access time of 5 ns, making it suitable for high-speed data processing tasks. It supports a supply voltage range of 1.7V to 1.95V and is housed in a surface-mount 60FBGA package, which is ideal for compact and high-density PCB designs.

AS4C64M16MD1-6BIN Features

  • High-Speed Performance: With an access time of 5 ns and a clock frequency of 166 MHz, the AS4C64M16MD1-6BIN delivers rapid data retrieval and processing capabilities, essential for applications demanding quick response times.
  • Volatile Memory: As a DRAM device, it provides volatile memory storage, which is ideal for temporary data storage and caching, ensuring data integrity during active use.
  • Wide Voltage Range: The chip operates within a voltage range of 1.7V to 1.95V, offering flexibility in power supply design and compatibility with various power management systems.
  • Parallel Interface: The parallel memory interface allows for efficient data transfer and integration with existing systems that utilize parallel data buses.
  • Surface-Mount Technology: The surface-mount 60FBGA package is suitable for modern PCB designs, enabling high-density layouts and compact form factors.
  • Compliance and Reliability: The AS4C64M16MD1-6BIN is REACH unaffected and RoHS3 compliant, ensuring it meets environmental and safety standards. It also has a moisture sensitivity level (MSL) of 3, allowing for 168 hours of exposure before reflow soldering.
  • Write Cycle Time: The write cycle time of 15ns ensures efficient data writing operations, maintaining overall system performance.

AS4C64M16MD1-6BIN Applications

The AS4C64M16MD1-6BIN is ideal for a variety of applications that require high-speed, temporary data storage and processing. Some specific use cases include:

  • Networking Equipment: Routers, switches, and other networking devices benefit from the fast access times and high-speed performance of the AS4C64M16MD1-6BIN, enabling efficient data buffering and routing.
  • Telecommunications: Base stations and communication systems can leverage the chip's capabilities for temporary data storage and rapid data retrieval, enhancing overall system performance.
  • Industrial Control Systems: Automation and control systems in industrial environments require reliable and fast memory solutions, making the AS4C64M16MD1-6BIN a suitable choice for temporary data storage and processing.
  • Consumer Electronics: High-performance gaming consoles, multimedia devices, and other consumer electronics can utilize the chip's high-speed capabilities for caching and temporary data storage, improving user experience.

Conclusion of AS4C64M16MD1-6BIN

The AS4C64M16MD1-6BIN is a high-performance DRAM memory IC chip that offers significant advantages over similar models. Its fast access times, high clock frequency, and wide voltage range make it suitable for a wide range of applications, from networking equipment to consumer electronics. The chip's compliance with environmental and safety standards, along with its surface-mount package, ensures it is a reliable and versatile choice for modern electronic designs. Despite its obsolete status, the AS4C64M16MD1-6BIN remains a valuable component for applications requiring high-speed, temporary data storage and processing.

FAQ

What voltage specification is listed for AS4C64M16MD1-6BIN?
The listed voltage-related specification for AS4C64M16MD1-6BIN is 1.7V ~ 1.95V.
What operating temperature range does AS4C64M16MD1-6BIN support?
What is the mounting type of AS4C64M16MD1-6BIN?
What is AS4C64M16MD1-6BIN?
What package or case is AS4C64M16MD1-6BIN available in?
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