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AS4C64M8D2-25BIN

AS4C64M8D2-25BIN Description

The AS4C64M8D2-25BIN is a high-performance 512Mbit DRAM memory IC designed by Alliance Memory, Inc. This device is ideal for applications requiring fast access times and reliable data storage. The AS4C64M8D2-25BIN features a memory organization of 64M x 8, providing a robust and efficient memory solution. It operates with a clock frequency of 400 MHz, ensuring rapid data processing and transfer. The access time of 400 picoseconds (ps) and a write cycle time of 15 nanoseconds (ns) make it highly suitable for high-speed applications.

This DRAM IC is packaged in a 60-ball FBGA (Fine Ball Grid Array) format, which is ideal for surface-mount technology (SMT) applications. The supply voltage range of 1.7V to 1.9V ensures compatibility with modern low-power systems. The AS4C64M8D2-25BIN is also compliant with environmental standards, being REACH unaffected and RoHS3 compliant. It has a moisture sensitivity level (MSL) of 3, which allows for a storage time of up to 168 hours in a controlled environment.

AS4C64M8D2-25BIN Features

• High-Speed Performance: With a clock frequency of 400 MHz and an access time of 400 ps, the AS4C64M8D2-25BIN delivers exceptional speed and efficiency.
• Volatile Memory: The DRAM memory type ensures that data is retained as long as power is supplied, making it suitable for applications requiring frequent data updates.
• Low-Power Operation: The voltage range of 1.7V to 1.9V supports low-power consumption, ideal for battery-operated and energy-efficient systems.
• Parallel Interface: The parallel memory interface allows for high-speed data transfer and compatibility with various system architectures.
• Compliance and Reliability: The AS4C64M8D2-25BIN is REACH unaffected and RoHS3 compliant, ensuring it meets environmental and safety standards. The MSL 3 rating ensures reliability in moisture-sensitive environments.
• Surface-Mount Compatibility: The 60FBGA package is designed for surface-mount technology, making it suitable for modern PCB designs and automated assembly processes.

AS4C64M8D2-25BIN Applications

The AS4C64M8D2-25BIN is well-suited for a variety of applications that demand high-speed and reliable memory solutions. Some specific use cases include:

• Networking Equipment: Ideal for routers, switches, and other network devices that require fast data processing and storage.
• Telecommunications: Suitable for base stations and communication systems where high-speed data transfer is crucial.
• Embedded Systems: Perfect for embedded systems in industrial, automotive, and consumer electronics where low power consumption and high performance are required.
• Computing Systems: Can be used in servers and workstations for temporary data storage and high-speed processing.

Conclusion of AS4C64M8D2-25BIN

The AS4C64M8D2-25BIN from Alliance Memory, Inc. is a high-performance DRAM IC that offers exceptional speed and reliability. Its 400 MHz clock frequency, 400 ps access time, and 15 ns write cycle time make it a superior choice for high-speed applications. The low-power operation, compliance with environmental standards, and surface-mount compatibility further enhance its appeal. Whether used in networking equipment, telecommunications, embedded systems, or computing systems, the AS4C64M8D2-25BIN provides a reliable and efficient memory solution.