Alliance Memory, Inc._AS6C1008-55BIN
original

Alliance Memory, Inc.
AS6C1008-55BIN

774-AS6C1008-55BIN
PDF Datasheet
IC SRAM 1MBIT PARALLEL 36TFBGA
16 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
Parallel
ECCN
EAR99
Memory Organization
128K x 8
Mounting Type
Surface Mount
Memory Type
Volatile
Product Status
Active
Supplier Device Package
36-TFBGA (6x8)
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AS6C1008-55BIN Description

AS6C1008-55BIN Description

The AS6C1008-55BIN is a high-performance, 1Mbit Static Random Access Memory (SRAM) IC designed for a wide range of applications requiring reliable and fast data storage. Manufactured by Alliance Memory, Inc., this memory chip features a parallel memory interface and is organized as 128K x 8 bits, providing a total memory capacity of 1Mbit. The AS6C1008-55BIN is designed for surface mount applications and is available in a 36-TFBGA package, making it suitable for compact and high-density designs.

This SRAM IC operates within a wide voltage range of 2.7V to 5.5V, ensuring compatibility with various power supply configurations. With an access time and write cycle time of 55ns, the AS6C1008-55BIN delivers rapid data read and write capabilities, essential for high-speed processing applications. The device is classified under ECCN EAR99 and HTSUS 8542.32.0041, and it is REACH unaffected and ROHS3 compliant, adhering to stringent environmental and safety standards.

AS6C1008-55BIN Features

  • Memory Organization: 128K x 8 bits, providing a total memory capacity of 1Mbit.
  • Access Time: 55ns, ensuring fast data retrieval and processing.
  • Write Cycle Time: 55ns, enabling rapid data storage.
  • Voltage Range: 2.7V to 5.5V, offering flexibility in power supply requirements.
  • Memory Type: Volatile SRAM, ideal for applications requiring frequent data updates.
  • Mounting Type: Surface Mount, suitable for compact and high-density designs.
  • Package: 36-TFBGA, providing a robust and space-efficient solution.
  • Moisture Sensitivity Level (MSL): Level 3 (168 Hours), ensuring reliability in various environmental conditions.
  • Compliance: REACH unaffected and ROHS3 compliant, meeting environmental and safety standards.

AS6C1008-55BIN Applications

The AS6C1008-55BIN is well-suited for a variety of applications where fast and reliable data storage is critical. Its high-speed access and write capabilities make it ideal for use in:

  • Embedded Systems: Providing fast and efficient memory for microcontrollers and microprocessors.
  • Networking Equipment: Enabling rapid data buffering and processing in routers and switches.
  • Industrial Control Systems: Offering reliable memory solutions for real-time data processing and control.
  • Consumer Electronics: Enhancing performance in devices such as gaming consoles, digital cameras, and smart TVs.
  • Automotive Electronics: Supporting high-speed data processing in advanced driver-assistance systems (ADAS) and infotainment systems.

Conclusion of AS6C1008-55BIN

The AS6C1008-55BIN from Alliance Memory, Inc. stands out as a versatile and high-performance SRAM IC, offering a balance of speed, capacity, and reliability. Its 55ns access and write cycle times, combined with a wide voltage range and surface mount compatibility, make it an excellent choice for a broad range of applications. The device's compliance with environmental and safety standards ensures it meets the demands of modern electronics manufacturing. Whether used in embedded systems, networking equipment, or consumer electronics, the AS6C1008-55BIN delivers the performance and reliability needed to support advanced technology solutions.

FAQ

What is the mounting type of AS6C1008-55BIN?
AS6C1008-55BIN uses a Surface Mount mounting style based on the listed product specifications.
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