Alliance Memory, Inc._AS6C1608-55BIN
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Alliance Memory, Inc.
AS6C1608-55BIN

774-AS6C1608-55BIN
PDF Datasheet
IC SRAM 16MBIT PARALLEL 48TFBGA

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Tech Specifications

Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
Parallel
ECCN
3A991B2A
Memory Organization
2M x 8
Mounting Type
Surface Mount
Memory Type
Volatile
Product Status
Obsolete
Supplier Device Package
48-TFBGA (8x10)
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AS6C1608-55BIN Description

AS6C1608-55BIN Description

The AS6C1608-55BIN is a high-performance, 16 Mbit Static Random Access Memory (SRAM) IC designed for applications requiring fast access times and reliable data storage. Manufactured by Alliance Memory, Inc., this memory IC chip features a parallel memory interface and is organized as 2M x 8, providing a robust solution for various electronic systems. The AS6C1608-55BIN operates within a supply voltage range of 2.7V to 3.6V and offers an access time of 55 nanoseconds, ensuring rapid data retrieval. This surface-mount device is packaged in a 48-TFBGA format, making it suitable for compact and high-density designs. Despite its obsolete status, the AS6C1608-55BIN remains a viable option for legacy systems and specific applications where its performance characteristics are essential.

AS6C1608-55BIN Features

  • Memory Organization: 2M x 8, providing a total memory capacity of 16 Mbit.
  • Access Time: 55 ns, ensuring fast data access and retrieval.
  • Write Cycle Time: 55 ns for both word and page operations, maintaining high-speed data handling.
  • Memory Type: Volatile SRAM, offering fast read and write capabilities.
  • Supply Voltage: Operates within a range of 2.7V to 3.6V, providing flexibility in power supply requirements.
  • Mounting Type: Surface mount, ideal for compact and high-density PCB designs.
  • Package: 48-TFBGA, ensuring a small footprint and efficient thermal performance.
  • Moisture Sensitivity Level (MSL): Level 3 (168 hours), suitable for standard manufacturing processes.
  • Compliance: REACH unaffected and ROHS3 compliant, ensuring environmental safety and regulatory adherence.
  • Memory Interface: Parallel, facilitating straightforward integration with existing systems.

AS6C1608-55BIN Applications

The AS6C1608-55BIN is well-suited for applications that demand high-speed data access and reliable memory performance. Its fast access time and write cycle time make it ideal for:

  • Embedded Systems: Providing fast and reliable memory for microcontroller-based systems.
  • Networking Equipment: Enhancing the performance of routers, switches, and other networking devices.
  • Industrial Control Systems: Ensuring rapid data processing and storage in industrial automation and control applications.
  • Telecommunications: Supporting high-speed data transfer and storage in telecom infrastructure.
  • Consumer Electronics: Improving the performance of devices such as gaming consoles, digital cameras, and other consumer products.

Conclusion of AS6C1608-55BIN

The AS6C1608-55BIN, manufactured by Alliance Memory, Inc., is a high-performance SRAM IC that offers a balance of speed, reliability, and compatibility. Its 55 ns access time and write cycle time make it an excellent choice for applications requiring rapid data access and processing. The 2M x 8 memory organization and 16 Mbit capacity provide ample storage for various electronic systems. Despite being marked as obsolete, the AS6C1608-55BIN remains a valuable component for legacy systems and specific applications where its performance characteristics are critical. With its surface-mount design, compact 48-TFBGA package, and compliance with environmental regulations, the AS6C1608-55BIN continues to be a reliable option for engineers and designers in the electronics industry.

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