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AS6C8016B-55BIN

AS6C8016B-55BIN Description

The AS6C8016B-55BIN is a high-performance, 8MB parallel SRAM memory IC chip manufactured by Alliance Memory, Inc. This device is designed for surface mount applications and is packaged in a 48FPBGA format, making it suitable for a wide range of electronic systems that require high-density memory solutions. The AS6C8016B-55BIN operates with a parallel interface, ensuring fast data transfer rates and efficient performance. It is classified under the HTSUS code 8542.32.0041 and is available in a tray package, facilitating easy handling and integration into various electronic assemblies.

AS6C8016B-55BIN Features

• High-Density Memory: The AS6C8016B-55BIN offers 8MB of static RAM, providing ample storage for complex applications requiring large data sets.
• Parallel Interface: This memory IC features a parallel interface, enabling rapid data transfer and ensuring compatibility with systems that rely on parallel communication protocols.
• Surface Mount Technology (SMT): The surface mount mounting type ensures reliable and space-efficient integration into modern electronic designs.
• Moisture Sensitivity Level (MSL) 3: With a moisture sensitivity level of 3, the AS6C8016B-55BIN can withstand up to 168 hours of exposure to standard environmental conditions, making it suitable for a variety of industrial and consumer applications.
• Compliance and Status:
  • ECCN: EAR99
  • REACH Status: REACH Unaffected
  • RoHS Status: ROHS3 Compliant
• Product Status: Active, ensuring continued availability and support for ongoing projects.
• DigiKey Programmable: Not Verified, indicating that while it may be programmable, this has not been verified by DigiKey.

AS6C8016B-55BIN Applications

The AS6C8016B-55BIN is ideal for applications that require high-speed, non-volatile memory solutions. Some specific use cases include:

• Industrial Control Systems: Providing reliable memory storage for programmable logic controllers (PLCs) and other industrial automation equipment.
• Telecommunications: Enhancing the performance of network routers, switches, and other communication infrastructure devices.
• Consumer Electronics: Used in high-end gaming consoles, digital cameras, and other devices that require fast access to large amounts of data.
• Medical Devices: Ensuring data integrity and quick access in medical imaging and diagnostic equipment.
• Automotive Electronics: Supporting advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems.

Conclusion of AS6C8016B-55BIN

The AS6C8016B-55BIN from Alliance Memory, Inc. stands out as a robust and reliable memory IC chip, offering significant advantages over similar models. Its high-density 8MB SRAM, parallel interface, and surface mount compatibility make it a versatile solution for a wide range of applications. The moisture sensitivity level of 3 and compliance with REACH and RoHS3 standards further enhance its suitability for diverse industrial and consumer environments. Whether used in industrial control systems, telecommunications, or consumer electronics, the AS6C8016B-55BIN delivers exceptional performance and reliability, making it an ideal choice for engineers and designers seeking a high-quality memory solution.