Alliance Memory, Inc.

AS9F38G08SA-25BIN

AS9F38G08SA-25BIN Description

The AS9F38G08SA-25BIN is a high-performance memory IC chip designed and manufactured by Alliance Memory, Inc., a leading provider of memory solutions. This 4Gbit FLASH memory device is organized as 512M x 8, offering robust storage capabilities in a compact package. It features a parallel memory interface, which ensures efficient data transfer and compatibility with a wide range of systems. The AS9F38G08SA-25BIN is designed for surface mount applications, making it ideal for modern electronic devices that require high-density memory solutions.

AS9F38G08SA-25BIN Features

• Memory Interface: Parallel, ensuring high-speed data transfer and compatibility with various systems.
• Memory Organization: 512M x 8, providing a balanced combination of memory capacity and data width.
• Mounting Type: Surface Mount, suitable for space-constrained applications.
• Access Time: 20 ns, ensuring rapid data retrieval and high system performance.
• Write Cycle Time: 25ns for word operations and 700µs for page operations, delivering efficient write capabilities.
• Memory Size: 4Gbit, offering substantial storage capacity.
• Voltage - Supply: 2.7V to 3.6V, providing flexibility in power supply requirements.
• Package: Tray, ensuring safe and reliable handling during manufacturing processes.
• REACH Status: REACH Unaffected, ensuring compliance with stringent environmental regulations.
• RoHS Status: ROHS3 Compliant, meeting the latest environmental standards.
• Moisture Sensitivity Level (MSL): 3 (168 Hours), providing protection against moisture damage during storage and handling.

AS9F38G08SA-25BIN Applications

The AS9F38G08SA-25BIN is ideal for a variety of applications that require high-density, high-speed memory solutions. Its parallel interface and fast access times make it suitable for:

• Embedded Systems: Providing reliable storage for firmware and critical data in embedded devices.
• Networking Equipment: Enhancing the performance of routers, switches, and other networking devices by offering fast data access.
• Industrial Control Systems: Ensuring robust and reliable memory solutions for industrial automation and control systems.
• Consumer Electronics: Enhancing the storage capabilities of devices such as digital cameras, gaming consoles, and smart TVs.
• Telecommunications: Supporting high-speed data storage and retrieval in telecommunications infrastructure.

Conclusion of AS9F38G08SA-25BIN

The AS9F38G08SA-25BIN from Alliance Memory, Inc. stands out as a reliable and high-performance memory IC chip. Its 4Gbit FLASH memory, organized as 512M x 8, provides substantial storage capacity while maintaining a compact footprint. The parallel memory interface ensures efficient data transfer, making it suitable for a wide range of applications. With a fast access time of 20 ns and a write cycle time of 25ns for word operations and 700µs for page operations, the AS9F38G08SA-25BIN delivers superior performance. Its compliance with REACH and ROHS3 standards, along with a moisture sensitivity level of 3, ensures that it meets the highest environmental and reliability standards. Whether used in embedded systems, networking equipment, industrial control systems, consumer electronics, or telecommunications, the AS9F38G08SA-25BIN offers a versatile and reliable memory solution.