Alliance Memory, Inc._PC28F128P33BF60A
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Alliance Memory, Inc.
PC28F128P33BF60A

774-PC28F128P33BF60A
PDF Datasheet
IC FLASH 128MBIT PAR 64EASYBGA
8 Weeks

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Tech Specifications

Clock Frequency
52 MHz
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
64-EasyBGA (10x13)
Access Time
60 ns
Package / Case
64-TBGA
Technology
FLASH - NOR
Voltage - Supply
1.7V ~ 2V
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PC28F128P33BF60A Description

PC28F128P33BF60A Description

The PC28F128P33BF60A is a high-performance flash memory IC chip manufactured by Alliance Memory, Inc. This 128 Mbit memory device is designed with a parallel memory interface and is part of the StrataFlash™ series. It features an 8M x 16 memory organization, providing a robust solution for various memory-intensive applications. The chip operates at a clock frequency of 52 MHz and offers an access time of 60 ns, ensuring fast data retrieval and processing capabilities. It is designed to function within a supply voltage range of 1.7V to 2V, making it suitable for low-power applications.

The PC28F128P33BF60A is housed in a surface-mount package, specifically a 60-ball BGA, which allows for efficient integration into compact and high-density PCB designs. The device is REACH unaffected and RoHS3 compliant, ensuring it meets the latest environmental and safety standards. It also has a moisture sensitivity level (MSL) of 3, allowing for a 168-hour exposure period, which is ideal for manufacturing processes that may involve exposure to varying humidity levels.

PC28F128P33BF60A Features

  • Memory Size and Organization: The PC28F128P33BF60A provides a substantial 128 Mbit memory capacity, organized as 8M x 16, offering ample storage for complex data and program code.
  • High-Speed Performance: With a clock frequency of 52 MHz and an access time of 60 ns, this IC ensures rapid data access and processing, making it suitable for high-speed applications.
  • Low-Power Operation: The device operates within a voltage range of 1.7V to 2V, making it ideal for applications where power consumption is a critical factor.
  • Parallel Memory Interface: The parallel interface allows for efficient data transfer and integration with various systems requiring high-speed data access.
  • Surface-Mount Packaging: The 60-ball BGA package is designed for surface-mount technology, enabling compact and high-density PCB designs.
  • Environmental Compliance: The PC28F128P33BF60A is REACH unaffected and RoHS3 compliant, ensuring it meets environmental and safety standards.
  • Moisture Sensitivity Level: With an MSL of 3 (168 hours), the device is suitable for manufacturing processes that may involve exposure to varying humidity levels.

PC28F128P33BF60A Applications

The PC28F128P33BF60A is ideal for a range of applications requiring high-speed, low-power, and high-density memory solutions. Some specific use cases include:

  • Embedded Systems: Suitable for embedded systems where fast data access and low power consumption are essential.
  • Telecommunications: Ideal for telecommunication equipment requiring high-speed memory for data storage and retrieval.
  • Consumer Electronics: Applicable in consumer electronics such as gaming consoles, smart TVs, and other devices that require robust memory solutions.
  • Industrial Control Systems: Useful in industrial control systems where reliability and fast data processing are critical.
  • Automotive Electronics: Suitable for automotive applications where high-speed memory and low power consumption are required.

Conclusion of PC28F128P33BF60A

The PC28F128P33BF60A from Alliance Memory, Inc. is a high-performance flash memory IC chip that offers a combination of high-speed operation, low-power consumption, and robust environmental compliance. Its 128 Mbit capacity, organized as 8M x 16, and its parallel memory interface make it a versatile solution for various applications. The device's surface-mount packaging and moisture sensitivity level of 3 further enhance its suitability for modern manufacturing processes. The PC28F128P33BF60A is an excellent choice for applications in embedded systems, telecommunications, consumer electronics, industrial control systems, and automotive electronics, where high-speed, low-power, and high-density memory solutions are required.

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