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Tech Specifications
Mounting
Surface Mount
Supplier Package
BGA
HTS
8542.31.00.70
Lead Shape
Ball
ECCN (US)
5A992c.
Part Status
Unconfirmed
PPAP
No
Package Width
24.5
GE208VIKJ23HM Description
System-on-Chip (SOC)
FAQ
What package or case is GE208VIKJ23HM available in?
GE208VIKJ23HM is available in the BGA package / case.
What is the mounting type of GE208VIKJ23HM?
What is the standard lead time for GE208VIKJ23HM?
Are there related or alternative parts for GE208VIKJ23HM?
What is GE208VIKJ23HM?
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