AMD_XC17S10XLVOG8I
original

AMD
XC17S10XLVOG8I

697-XC17S10XLVOG8I
IC PROM SERIEAL 10K 8-SOIC

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Tech Specifications

Operating Temperature
-40°C ~ 85°C
ECCN
EAR99
Programmable Type
OTP
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
8-TSOP
Series
-
Memory Size
100kb
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XC17S10XLVOG8I Description

XC17S10XLVOG8I Description

The XC17S10XLVOG8I is an IC PROM Serial 10K 8-SOIC memory chip manufactured by AMD. This memory IC chip is designed for surface mount applications and features a programmable OTP (One-Time Programmable) type with a memory size of 100kb. It operates within a voltage supply range of 3V to 3.6V, making it suitable for a variety of low-power applications. The XC17S10XLVOG8I is housed in an 8-SOIC package and is available in a tray packaging format. This product has a moisture sensitivity level (MSL) of 3, allowing for a 168-hour exposure period before assembly. It is important to note that this product has been marked as obsolete by the manufacturer, AMD, and its ECCN (Export Control Classification Number) is EAR99, indicating it is subject to the Export Administration Regulations. The product is also REACH unaffected, ensuring compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals regulation.

XC17S10XLVOG8I Features

  • Programmable OTP Type: The XC17S10XLVOG8I features a One-Time Programmable (OTP) memory type, which allows for secure and permanent storage of data or code. This is particularly useful for applications requiring high security and tamper resistance.
  • 100kb Memory Size: With a memory capacity of 100kb, this IC is well-suited for applications that require moderate storage capacity without the need for excessive memory overhead.
  • Low Voltage Operation: The ability to operate within a voltage range of 3V to 3.6V makes this IC ideal for low-power and battery-operated devices, ensuring efficient power usage and extended operational life.
  • Surface Mount Technology (SMT): The surface mount mounting type allows for compact and reliable integration into modern electronic devices, facilitating high-density PCB designs and automated assembly processes.
  • Moisture Sensitivity Level 3: The MSL 3 rating ensures that the IC can withstand up to 168 hours of exposure to moisture before assembly, providing flexibility in manufacturing and handling processes.
  • Tray Packaging: The product is packaged in trays, which is beneficial for bulk handling and storage in manufacturing environments, ensuring the ICs remain protected and organized.

XC17S10XLVOG8I Applications

The XC17S10XLVOG8I is designed for a variety of applications where secure, permanent storage of data or code is required. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems that require non-volatile memory for storing firmware or critical data.
  • Consumer Electronics: Suitable for low-power consumer electronics devices that need secure and reliable memory solutions.
  • Industrial Control Systems: Can be used in industrial control systems where data integrity and security are paramount.
  • Telecommunications: Useful in telecommunications equipment for storing configuration data and firmware.
  • Automotive Applications: Applicable in automotive systems for storing critical data and code that must remain secure and tamper-proof.

Conclusion of XC17S10XLVOG8I

The XC17S10XLVOG8I is a versatile and secure memory IC chip that offers a range of benefits for applications requiring OTP memory solutions. Its low-power operation, compact surface mount design, and moderate memory capacity make it suitable for a variety of low-power and space-constrained applications. While the product has been marked as obsolete, it still provides a reliable and secure option for applications where OTP memory is required. For those looking for a secure, permanent memory solution, the XC17S10XLVOG8I remains a viable choice, especially in applications where its unique features and advantages can be fully utilized.

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