AMD_XC17S30PD8I
original

AMD
XC17S30PD8I

697-XC17S30PD8I
IC PROM PROG I-TEMP 5V 8-DIP

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Tech Specifications

Operating Temperature
-40°C ~ 85°C
ECCN
EAR99
Programmable Type
OTP
Mounting Type
Through Hole
Product Status
Obsolete
Supplier Device Package
8-PDIP
Series
-
Memory Size
300kb
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XC17S30PD8I Description

XC17S30PD8I Description

The XC17S30PD8I is an OTP (One-Time Programmable) configuration memory device from AMD, designed for use with FPGAs to store configuration data. This 300kb memory IC operates within a 4.5V to 5.5V supply range and is housed in an 8-DIP (Dual In-line Package), making it suitable for through-hole mounting. As an obsolete product, it remains relevant for legacy systems requiring reliable, non-volatile storage. Its OTP nature ensures data integrity, while its REACH Unaffected and EAR99 classifications indicate compliance with environmental and export regulations.

XC17S30PD8I Features

  • Memory Capacity: 300kb, sufficient for medium-density FPGA configurations.
  • OTP Programming: Ensures secure, permanent data storage without the risk of accidental erasure.
  • Wide Voltage Range: Operates at 4.5V–5.5V, compatible with standard 5V systems.
  • Through-Hole Mounting: 8-DIP package facilitates easy integration into legacy PCB designs.
  • Industrial Temperature Support: Designed for reliable performance in industrial environments.
  • Regulatory Compliance: EAR99 and REACH Unaffected status simplifies global deployment.

XC17S30PD8I Applications

  • FPGA Configuration: Ideal for storing boot configurations for AMD/Xilinx FPGAs in embedded systems.
  • Legacy Industrial Systems: Suited for maintaining or repairing older equipment where modern alternatives are incompatible.
  • Aerospace & Defense: OTP reliability makes it valuable for secure, tamper-proof applications.
  • Automotive Electronics: Used in systems requiring stable, one-time programmable memory for critical functions.

Conclusion of XC17S30PD8I

The XC17S30PD8I offers a robust, OTP-based memory solution for FPGA configuration, particularly in legacy and industrial applications. Its 300kb capacity, 5V compatibility, and through-hole packaging make it a practical choice for systems requiring durable, one-time programmable storage. While obsolete, it remains a viable option for maintaining older designs or applications where data permanence is critical. Engineers working with AMD FPGAs in industrial, automotive, or aerospace sectors may find this IC indispensable for ensuring long-term system reliability.

FAQ

What package or case is XC17S30PD8I available in?
XC17S30PD8I is available in the 8-DIP (0.300", 7.62mm) package / case.
What is XC17S30PD8I?
What is the mounting type of XC17S30PD8I?
Does XC17S30PD8I have quantity-based pricing?
What voltage specification is listed for XC17S30PD8I?
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