AMD_XC2V6000-4FFG1517C
original

AMD
XC2V6000-4FFG1517C

696-XC2V6000-4FFG1517C
PDF Datasheet
IC FPGA 1104 I/O 1517FCBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
2654208
Number of LABs/CLBs
8448
ECCN
3A001A7A
Number of I/O
1104
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
1517-FCBGA (40x40)
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XC2V6000-4FFG1517C Description

AMD's XC2V6000-4FFG1517C is a high-performance, field-programmable gate array (FPGA) module designed for a wide range of applications that require high-speed processing and flexible programmability. This module is part of AMD's Xilinx product line, which is known for its advanced FPGA technology.

Description:

The XC2V6000-4FFG1517C is a Virtex-II Pro FPGA module that features a high-density architecture, making it suitable for complex and demanding applications. It is available in a fine-pitch ball grid array (FBGA) package, which allows for high-density integration and improved electrical performance.

Features:

  1. High-density architecture: The XC2V6000-4FFG1517C offers a high-density architecture, providing a large number of logic elements, digital signal processing (DSP) slices, and memory resources for complex designs.
  2. Advanced I/O capabilities: This FPGA module features a wide range of I/O options, including high-speed transceivers, multi-gigabit transceivers, and versatile I/O (VIO) capabilities, making it suitable for various communication and interface applications.
  3. On-chip memory: The XC2V6000-4FFG1517C includes a large amount of block RAM (BRAM) and distributed RAM, providing ample memory resources for data storage and processing.
  4. Digital signal processing: The FPGA module is equipped with a high number of DSP slices, enabling efficient implementation of digital signal processing algorithms.
  5. High-performance clocking: The XC2V6000-4FFG1517C features a high-performance clocking architecture, allowing for precise and stable clock management in various applications.
  6. Security features: This FPGA module includes security features such as secure boot, encryption, and authentication, ensuring the protection of sensitive data and intellectual property.

Applications:

  1. Telecommunications: The XC2V6000-4FFG1517C is well-suited for high-speed telecommunications applications, such as signal processing, network infrastructure, and data transmission.
  2. Industrial control: The FPGA module can be used in industrial control systems for real-time processing, motor control, and sensor integration.
  3. Automotive: The XC2V6000-4FFG1517C is suitable for advanced driver assistance systems (ADAS), infotainment systems, and other automotive applications that require high-speed processing and flexible programmability.
  4. Aerospace and defense: This FPGA module can be used in aerospace and defense applications, such as radar processing, satellite communication, and secure communication systems.
  5. High-performance computing: The XC2V6000-4FFG1517C is ideal for high-performance computing applications, including data processing, image processing, and machine learning.

In summary, AMD's XC2V6000-4FFG1517C is a powerful and versatile FPGA module that offers high-density architecture, advanced I/O capabilities, and a wide range of features suitable for various high-speed processing and flexible programmability applications.

FAQ

What operating temperature range does XC2V6000-4FFG1517C support?
XC2V6000-4FFG1517C has an operating temperature range of 0°C ~ 85°C (TJ).
What is XC2V6000-4FFG1517C?
What voltage specification is listed for XC2V6000-4FFG1517C?
Are there related or alternative parts for XC2V6000-4FFG1517C?
Is XC2V6000-4FFG1517C currently in stock?
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