AMD_XC3S1400A-4FG676C
original

AMD
XC3S1400A-4FG676C

696-XC3S1400A-4FG676C
IC FPGA 502 I/O 676FCBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
589824
Number of LABs/CLBs
2816
ECCN
3A001A7A
Number of I/O
502
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
676-FBGA (27x27)
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XC3S1400A-4FG676C Description

The XC3S1400A-4FG676C is a Field Programmable Gate Array (FPGA) device manufactured by AMD (previously known as Xilinx). Here is a brief description of the model, its features, and potential applications:

Model Description:

The XC3S1400A-4FG676C is a part of the Spartan-3A series of FPGAs, which are designed for a wide range of applications requiring a balance between performance, power consumption, and cost. This particular model is housed in a 676-ball FinePitch Ball Grid Array (FBGA) package.

Features:

  1. Device Family: Spartan-3A
  2. Package Type: FinePitch Ball Grid Array (FBGA)
  3. Package Pin Count: 676
  4. Logic Elements: The device contains a significant number of logic elements suitable for a variety of digital designs.
  5. Memory Resources: It includes Block RAM (BRAM) for data storage and other memory-intensive applications.
  6. I/O Resources: Offers a variety of I/O options, including configurable I/O pins for interfacing with external components.
  7. Clock Management: Features clock management capabilities to support different clock domains and frequencies.
  8. Power Consumption: Designed with power efficiency in mind, suitable for applications where low power consumption is critical.
  9. Temperature Range: Typically, these devices are available for commercial temperature ranges, ensuring reliability in various operating environments.

Applications:

The XC3S1400A-4FG676C FPGA can be used in a wide array of applications due to its flexibility and programmability:

  1. Embedded Systems: As the core processing unit in embedded systems where custom hardware logic can be implemented.
  2. Communication Systems: For protocol handling, data buffering, and signal processing in communication devices.
  3. Industrial Control: In industrial automation for control logic, interfacing with sensors, and actuators.
  4. Video Processing: For video signal processing, image recognition, and display control in surveillance and multimedia systems.
  5. Medical Equipment: In medical devices for signal processing and control where reliability and precision are crucial.
  6. Automotive Systems: For in-vehicle networking, vision systems, and control applications.
  7. Military and Aerospace: Due to its robustness, it can be used in defense and aerospace applications for signal processing and control systems.
  8. Prototyping and Development: As a platform for developing and testing new digital logic designs before committing to an Application-Specific Integrated Circuit (ASIC).

When using the XC3S1400A-4FG676C or any FPGA, developers can take advantage of the device's reprogrammability to update the logic design in the field, offering a high degree of flexibility and adaptability for evolving requirements.

FAQ

What is the mounting type of XC3S1400A-4FG676C?
XC3S1400A-4FG676C uses a Surface Mount mounting style based on the listed product specifications.
What operating temperature range does XC3S1400A-4FG676C support?
Is XC3S1400A-4FG676C currently in stock?
Does XC3S1400A-4FG676C have quantity-based pricing?
What is XC3S1400A-4FG676C?
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