AMD_XC3S1400A-4FTG256I
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AMD
XC3S1400A-4FTG256I

696-XC3S1400A-4FTG256I
IC FPGA 161 I/O 256FTBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
589824
Number of LABs/CLBs
2816
ECCN
3A001A7B
Number of I/O
161
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
256-FTBGA (17x17)
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XC3S1400A-4FTG256I Description

The XC3S1400A-4FTG256I is a field programmable gate array (FPGA) device manufactured by AMD (now part of Xilinx). Here's a brief description of the model, its features, and potential applications:

Description:

The XC3S1400A-4FTG256I is a mid-range FPGA device belonging to the Spartan-3A series. It is designed to offer a balance between performance, power efficiency, and cost-effectiveness, making it suitable for a wide range of applications requiring programmable logic solutions.

Features:

  1. Device Family: Spartan-3A
  2. Package Type: Flip-Chip Ball Grid Array (FCBGA)
  3. Package Density: 256-I/O (Input/Output)
  4. Gate Count: The XC3S1400A provides approximately 14,000 logic cells, suitable for moderate complexity designs.
  5. Speed Grade: -4, indicating a faster performance within the Spartan-3A series.
  6. Memory: The device includes block RAM (BRAM) for data storage and handling.
  7. Power Consumption: Designed for low-power applications, making it suitable for battery-powered or energy-sensitive systems.
  8. Temperature Range: Commercial (0°C to 70°C) and Industrial (-40°C to 85°C) temperature grades are available.
  9. Programmability: In-system programmable (ISP) and comes with a JTAG interface for easy reprogramming and debugging.
  10. I/O Options: A wide range of I/O standards and voltage levels to interface with various types of peripherals and systems.

Applications:

  1. Digital Signal Processing (DSP): Due to its moderate gate count and low power consumption, the XC3S1400A-4FTG256I can be used in DSP applications where real-time processing is required.
  2. Communications: Suitable for communication interfaces such as UARTs, SPI, I2C, and Ethernet, where programmable logic can be used to implement custom protocols or adapt to different standards.
  3. Control Systems: Can be used in the design of custom control systems for industrial automation, robotics, or automotive applications.
  4. Embedded Systems: As a core component in embedded systems where a flexible hardware platform is needed to implement specific functionalities.
  5. Prototyping and Development: Ideal for prototyping complex digital systems before moving to an Application-Specific Integrated Circuit (ASIC) solution.
  6. Military and Aerospace: The industrial temperature range makes it suitable for use in military and aerospace applications where reliability and durability are critical.
  7. Medical Electronics: Can be used in medical devices that require low power consumption and customizable logic for signal processing and control.

The XC3S1400A-4FTG256I is a versatile FPGA that can be tailored to fit a variety of digital design needs, offering designers the flexibility to implement custom logic and interfaces as required by their specific applications.

FAQ

What is the mounting type of XC3S1400A-4FTG256I?
XC3S1400A-4FTG256I uses a Surface Mount mounting style based on the listed product specifications.
What package or case is XC3S1400A-4FTG256I available in?
What operating temperature range does XC3S1400A-4FTG256I support?
Does XC3S1400A-4FTG256I have quantity-based pricing?
Are there related or alternative parts for XC3S1400A-4FTG256I?
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