AMD_XC3S1400A-5FGG484C
original

AMD
XC3S1400A-5FGG484C

696-XC3S1400A-5FGG484C
IC FPGA 375 I/O 484FBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
589824
Number of LABs/CLBs
2816
ECCN
3A991D
Number of I/O
375
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
484-FBGA (23x23)
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XC3S1400A-5FGG484C Description

Model: XC3S1400A-5FGG484C

Description: The XC3S1400A-5FGG484C is a high-performance Field Programmable Gate Array (FPGA) manufactured by Advanced Micro Devices (AMD). This device belongs to the Spartan-3A series, which is designed for a wide range of applications requiring low power consumption, high integration, and cost-effective solutions.

Features:

  1. Programmable Logic: The XC3S1400A-5FGG484C offers a large amount of programmable logic resources, including approximately 1,400 Look-Up Tables (LUTs) and 8,200 flip-flops, allowing for complex digital designs to be implemented.
  2. I/O Count: This FPGA features 484 I/O (Input/Output) pins, providing a high-density interface for connecting to external components and systems.
  3. Speed Grade: The -5 speed grade indicates that the device operates at a maximum frequency of 500 MHz, making it suitable for applications requiring high-speed data processing.
  4. Power Consumption: The Spartan-3A series is designed for low power consumption, making it ideal for battery-powered or energy-sensitive applications.
  5. Memory Resources: The XC3S1400A-5FGG484C includes embedded memory resources, such as Block RAM (BRAM) and Distributed RAM (DRAM), which can be used for data storage and processing.
  6. Digital Signal Processing (DSP): The device offers DSP blocks that can be utilized for high-speed mathematical operations, making it suitable for applications requiring signal processing capabilities.
  7. Security Features: The FPGA provides security features, such as encryption and authentication, to protect intellectual property and ensure data integrity.
  8. Package Type: The 484C designation indicates that the device is housed in a Ceramic Grid Array (CGA) package, which offers excellent thermal performance and is suitable for high-density applications.

Applications:

  1. Communications: The XC3S1400A-5FGG484C can be used in various communication systems, such as routers, switches, and transceivers, due to its high-speed data processing capabilities.
  2. Industrial Automation: The device's low power consumption and high integration make it suitable for industrial control systems, such as programmable logic controllers (PLCs) and motor control applications.
  3. Medical Equipment: The FPGA can be used in medical imaging and diagnostic equipment, where high-speed data processing and low power consumption are critical.
  4. Automotive: The XC3S1400A-5FGG484C can be utilized in automotive applications, such as advanced driver assistance systems (ADAS), infotainment systems, and engine control units (ECUs).
  5. Consumer Electronics: The device can be used in consumer electronics, such as set-top boxes, gaming consoles, and smart home devices, where high-density integration and low power consumption are essential.
  6. Security Systems: The FPGA's security features make it suitable for applications requiring data protection and secure communication, such as encryption systems and access control devices.
  7. Aerospace and Defense: The XC3S1400A-5FGG484C can be used in aerospace and defense applications, where high reliability, low power consumption, and high-speed data processing are required.

FAQ

Are there related or alternative parts for XC3S1400A-5FGG484C?
Yes. Related or alternative parts may be available on this page when relevant product data is provided.
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