AMD_XC3S500E-5FTG256C
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AMD
XC3S500E-5FTG256C

696-XC3S500E-5FTG256C
IC FPGA 190 I/O 256FTBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
368640
Number of LABs/CLBs
1164
ECCN
3A001A7B
Number of I/O
190
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
256-FTBGA (17x17)
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XC3S500E-5FTG256C Description

The XC3S500E-5FTG256C is a high-performance Field Programmable Gate Array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device is part of the Virtex-5 family of FPGAs, which are designed to provide high levels of integration, performance, and flexibility for a wide range of applications.

Description:

The XC3S500E-5FTG256C is a mid-range Virtex-5 FPGA that offers a balance of size, performance, and power efficiency. It features a high-density architecture with up to 5,000 Look-Up Tables (LUTs) and 500 Digital Signal Processing (DSP) blocks, making it suitable for a wide range of applications, including communications, computing, and industrial systems.

Features:

  1. High-density architecture: The XC3S500E-5FTG256C offers up to 5,000 LUTs and 500 DSP blocks, providing a high level of integration and flexibility for complex designs.
  2. Advanced I/O capabilities: The device features a wide range of I/O options, including high-speed transceivers, multi-gigabit transceivers, and versatile I/O capabilities, making it suitable for various interface requirements.
  3. Low power consumption: The XC3S500E-5FTG256C is designed to provide low power consumption, making it suitable for applications where power efficiency is critical.
  4. High-performance clocking: The device offers advanced clocking capabilities, including dedicated clock regions and clock dividers, ensuring precise and reliable clock management.
  5. Robust design and reliability: The XC3S500E-5FTG256C is built using advanced manufacturing processes and offers a range of features to ensure robust design and reliability, including error-correcting code (ECC) and built-in self-test (BIST) capabilities.

Applications:

The XC3S500E-5FTG256C is suitable for a wide range of applications, including:

  1. Communications: The device's high-speed transceivers and versatile I/O capabilities make it ideal for applications such as telecom, networking, and wireless systems.
  2. Computing: The high-density architecture and advanced DSP blocks make the XC3S500E-5FTG256C suitable for high-performance computing applications, including data processing, image processing, and machine learning.
  3. Industrial systems: The device's robust design and reliability make it suitable for industrial applications, including motor control, power management, and automation systems.
  4. Aerospace and defense: The XC3S500E-5FTG256C can be used in aerospace and defense applications, where high levels of integration, performance, and reliability are required.
  5. Automotive: The device's low power consumption and advanced I/O capabilities make it suitable for automotive applications, including advanced driver assistance systems (ADAS) and infotainment systems.

In summary, the AMD XC3S500E-5FTG256C is a versatile and high-performance FPGA device that offers a balance of size, performance, and power efficiency. Its advanced features and capabilities make it suitable for a wide range of applications across various industries.

FAQ

What package or case is XC3S500E-5FTG256C available in?
XC3S500E-5FTG256C is available in the 256-LBGA package / case.
Are there related or alternative parts for XC3S500E-5FTG256C?
What voltage specification is listed for XC3S500E-5FTG256C?
Does XC3S500E-5FTG256C have quantity-based pricing?
What is the mounting type of XC3S500E-5FTG256C?
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