AMD_XC3S700A-4FGG400I
original

AMD
XC3S700A-4FGG400I

696-XC3S700A-4FGG400I
IC FPGA 311 I/O 400FBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
368640
Number of LABs/CLBs
1472
ECCN
3A991D
Number of I/O
311
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
400-FBGA (21x21)
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XC3S700A-4FGG400I Description

The XC3S700A-4FGG400I is a high-performance Field Programmable Gate Array (FPGA) device from AMD (previously known as Xilinx). This device belongs to the Virtex-6 family of FPGAs, which are known for their versatility, high performance, and advanced features. Here's a description of the XC3S700A-4FGG400I, its features, and applications:

Description:

The XC3S700A-4FGG400I is a mid-range Virtex-6 FPGA designed for a wide range of applications, including high-speed data processing, complex digital signal processing, and high-density logic implementation. It is available in a 4-layer Fine-Pitch Ball Grid Array (FBGA) package, which provides a compact form factor and excellent thermal performance.

Features:

  1. High-density logic resources: The XC3S700A-4FGG400I offers a large number of configurable logic blocks (CLBs) and digital signal processing slices (DSP48E1), making it suitable for complex digital designs.
  2. High-speed transceivers: This FPGA features 12.5 Gbps transceivers, which enable high-speed data transmission and reception in communication and networking applications.
  3. High-performance memory: The device includes block RAM (BRAM) and ultra-high-performance memory blocks (URAM) for high-speed data storage and processing.
  4. Integrated hard processor system (HPS): The XC3S700A-4FGG400I includes an HPS, which is an ARM-based processing system that can be used for general-purpose processing tasks alongside the FPGA fabric.
  5. High-speed I/O capabilities: The device supports a wide range of I/O standards, including LVCMOS, PCI Express, and Gigabit Ethernet, making it suitable for various interface requirements.
  6. Advanced power management: The FPGA offers dynamic power management features, allowing for efficient power consumption and thermal management.

Applications:

  1. Communications infrastructure: The XC3S700A-4FGG400I is well-suited for applications in telecommunications, such as line cards, routers, and switches, due to its high-speed transceivers and I/O capabilities.
  2. Video processing: The FPGA's high-density logic resources and DSP capabilities make it ideal for video processing applications, such as video encoding, decoding, and image processing.
  3. Industrial control systems: The device's versatility and high-performance capabilities make it suitable for complex control systems in industrial automation and robotics.
  4. Test and measurement: The XC3S700A-4FGG400I can be used in test and measurement equipment for signal processing, data acquisition, and analysis.
  5. Military and aerospace: The FPGA's high reliability and performance make it suitable for applications in military and aerospace systems, such as radar processing, satellite communications, and electronic warfare.

In summary, the XC3S700A-4FGG400I is a powerful and versatile FPGA from AMD's Virtex-6 family, offering a range of features that make it suitable for a wide variety of applications in communications, video processing, industrial control, test and measurement, and military and aerospace industries.

FAQ

What package or case is XC3S700A-4FGG400I available in?
XC3S700A-4FGG400I is available in the 400-BGA package / case.
What voltage specification is listed for XC3S700A-4FGG400I?
Are there related or alternative parts for XC3S700A-4FGG400I?
What is XC3S700A-4FGG400I?
What is the mounting type of XC3S700A-4FGG400I?
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