The XC3S700A-4FTG256C is a field programmable gate array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device belongs to the Virtex-5 family of FPGAs, which are known for their high performance, low power consumption, and advanced features.
Description:
The XC3S700A-4FTG256C is a high-density FPGA that provides a combination of logic elements, memory, and I/O resources. It is designed to meet the needs of a wide range of applications, including telecommunications, military, aerospace, and industrial control systems. The device is available in a 4FTG256C package, which is a flip-chip ball grid array (FCBGA) package with a high-density of I/O pins.
Features:
High-performance logic elements: The XC3S700A-4FTG256C features a large number of configurable logic blocks (CLBs) that can be used to implement a wide range of digital logic functions.
Memory resources: The device includes block RAM (BRAM) and distributed RAM, providing ample memory resources for data storage and processing.
I/O resources: The XC3S700A-4FTG256C offers a high number of I/O pins, making it suitable for applications that require a large number of external connections.
Low power consumption: The Virtex-5 FPGAs are designed to operate at low voltage levels, resulting in lower power consumption compared to previous generations of FPGAs.
Advanced features: The device supports advanced features such as digital clock managers (DCMs), phase-locked loops (PLLs), and high-speed transceivers, making it suitable for high-speed data communication and synchronization applications.
Applications:
The XC3S700A-4FTG256C is suitable for a wide range of applications, including:
Telecommunications: The device can be used in telecommunication systems for functions such as signal processing, data conversion, and network management.
Military and aerospace: The high reliability and performance of the XC3S700A-4FTG256C make it suitable for military and aerospace applications, such as radar systems, satellite communication, and navigation systems.
Industrial control systems: The device can be used in industrial control systems for functions such as motor control, sensor interfacing, and process automation.
High-speed data communication: The advanced features of the XC3S700A-4FTG256C, such as high-speed transceivers and PLLs, make it suitable for high-speed data communication applications, such as Ethernet switches and optical communication systems.
Custom computing: The flexibility and configurability of the XC3S700A-4FTG256C make it an ideal choice for custom computing applications, where specific hardware can be designed to meet the unique requirements of a particular application.
In summary, the AMD XC3S700A-4FTG256C is a high-performance, low-power FPGA device that offers a wide range of features and applications. Its versatility and advanced capabilities make it suitable for a variety of industries and applications, including telecommunications, military, aerospace, industrial control systems, and high-speed data communication.
Tech Specifications
Operating Temperature
Total RAM Bits
Number of LABs/CLBs
ECCN
Number of I/O
Mounting Type
Product Status
Supplier Device Package
Series
Package / Case
Voltage - Supply
REACH Status
Mfr
Number of Gates
HTSUS
Package
Number of Logic Elements/Cells
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)
Mounting Style
Number of Logic Elements
Distributed RAM
Embedded Memory
Adaptive Logic Modules - ALMs
RoHS
Supply Voltage - Min
Minimum Operating Temperature
Tradename
Embedded Block RAM - EBR
Data Rate
Moisture Sensitive
Operating Supply Voltage
Number of I/Os
Maximum Operating Temperature
Supply Voltage - Max
USHTS
Number of Transceivers
XC3S700A-4FTG256C Documents
Download datasheets and manufacturer documentation for XC3S700A-4FTG256C
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Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
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