AMD_XC6SLX150-3FGG676C
original

AMD
XC6SLX150-3FGG676C

696-XC6SLX150-3FGG676C
IC FPGA 498 I/O 676FBGA
12 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
4939776
Number of LABs/CLBs
11519
ECCN
3A991D
Number of I/O
498
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
676-FBGA (27x27)
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XC6SLX150-3FGG676C Description

The AMD XC6SLX150-3FGG676C is a Field Programmable Gate Array (FPGA) device manufactured by Advanced Micro Devices (AMD). Here is a description of the model, its features, and potential applications:

Model Description:

The XC6SLX150-3FGG676C is a member of the Spartan-6 family of FPGAs, which are known for their low power consumption and high integration density. This particular model is a mid-range device with a moderate number of logic elements and a balanced mix of features that make it suitable for a wide range of applications.

Features:

  1. Logic Elements: The XC6SLX150-3FGG676C contains a significant number of logic elements, which are the basic building blocks for digital logic functions.

  2. Memory Resources: It includes Block RAM (BRAM) and Distributed RAM (DRAM) resources, which can be used for data storage and processing.

  3. I/O Pins: The device offers a range of configurable I/O (input/output) pins, allowing it to interface with various external components.

  4. Clock Management: It has a dedicated clock management system that can support multiple clock domains and jitter-cleaning features.

  5. DSP Blocks: The FPGA includes digital signal processing (DSP) blocks that can be used for high-speed mathematical operations.

  6. Power Consumption: Spartan-6 FPGAs are designed with power efficiency in mind, making them suitable for applications where power consumption is a critical factor.

  7. Package Type: The "3FGG676C" in the model number indicates the specific package type, which in this case is a flip-chip ball grid array (FCBGA) package with 676 I/O pins.

  8. Temperature Range: This model is typically available in commercial (0°C to 70°C) and industrial (-40°C to 85°C) temperature ranges.

Applications:

  1. Communications: The XC6SLX150-3FGG676C can be used in communication systems for signal processing, protocol handling, and interface management.

  2. Industrial Control: Its robust I/O capabilities make it suitable for industrial control applications, including motor control and sensor interfacing.

  3. Medical Devices: Due to its low power consumption and high integration, it can be used in portable or battery-operated medical devices.

  4. Automotive: The device can be used in automotive applications for infotainment systems, driver assistance systems, and other electronic control units.

  5. Consumer Electronics: It can be employed in consumer electronics for image and video processing, audio processing, and general-purpose logic functions.

  6. Aerospace and Defense: The FPGA's ability to handle complex logic and signal processing makes it suitable for aerospace and defense applications where reliability and performance are crucial.

  7. Custom Computing: It can be programmed to perform specific tasks more efficiently than general-purpose processors, making it ideal for custom computing applications.

  8. Prototyping and Development: Due to its reprogrammability, the XC6SLX150-3FGG676C is often used in the prototyping and development stages of electronic systems.

It's important to note that the specific applications for this FPGA will depend on the design requirements, power constraints, and the complexity of the logic functions that need to be implemented.

FAQ

Are there related or alternative parts for XC6SLX150-3FGG676C?
Yes. Related or alternative parts may be available on this page when relevant product data is provided.
Does XC6SLX150-3FGG676C have quantity-based pricing?
What operating temperature range does XC6SLX150-3FGG676C support?
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Availability (In Stock : 22 )
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1+ $358.07200 $358.07
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