AMD_XC6SLX75-2FGG676C
original

AMD
XC6SLX75-2FGG676C

696-XC6SLX75-2FGG676C
IC FPGA 408 I/O 676FBGA
12 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
3170304
Number of LABs/CLBs
5831
ECCN
3A991D
Number of I/O
408
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
676-FBGA (27x27)
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XC6SLX75-2FGG676C Description

The XC6SLX75-2FGG676C is a field programmable gate array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device belongs to the Spartan-6 family of FPGAs, which are known for their low power consumption, high performance, and versatility.

Description:

The XC6SLX75-2FGG676C is a high-density FPGA that comes in a flip-chip ball grid array (FCBGA) package. It features a high level of integration and a wide range of configurable logic blocks, making it suitable for a variety of applications.

Features:

  1. High-density architecture: The XC6SLX75-2FGG676C offers a high-density architecture with up to 75,000 logic cells, making it suitable for complex designs and large-scale applications.
  2. Low power consumption: The Spartan-6 family of FPGAs is designed for low power consumption, making the XC6SLX75-2FGG676C an ideal choice for battery-powered or energy-sensitive applications.
  3. Versatile I/O options: The device provides a wide range of I/O options, including LVCMOS, LVDS, and DDR interfaces, allowing for easy integration with various peripherals and systems.
  4. Configurable logic blocks: The XC6SLX75-2FGG676C features configurable logic blocks that can be programmed to perform a variety of functions, making it highly adaptable for different applications.
  5. High-performance clocking: The device offers high-performance clocking capabilities, supporting up to 600 MHz of system performance.
  6. Security features: The XC6SLX75-2FGG676C includes security features such as encryption and user-defined constraints to protect intellectual property and ensure secure operation.

Applications:

The XC6SLX75-2FGG676C is suitable for a wide range of applications due to its high-density architecture, low power consumption, and versatility. Some potential applications include:

  1. Industrial control systems: The device can be used in industrial control systems for tasks such as motor control, data acquisition, and process automation.
  2. Communication systems: The XC6SLX75-2FGG676C can be used in communication systems for functions such as signal processing, data conversion, and network management.
  3. Automotive systems: The low power consumption and high-performance capabilities of the device make it suitable for use in automotive systems, such as advanced driver assistance systems (ADAS) and infotainment systems.
  4. Consumer electronics: The FPGA can be used in consumer electronics for applications such as image and video processing, gaming consoles, and smart home devices.
  5. Aerospace and defense: The XC6SLX75-2FGG676C can be used in aerospace and defense applications for signal processing, data encryption, and communication systems.

In summary, the AMD XC6SLX75-2FGG676C is a high-density, low-power FPGA with versatile features that make it suitable for a wide range of applications, including industrial control systems, communication systems, automotive systems, consumer electronics, and aerospace and defense.

FAQ

Are there related or alternative parts for XC6SLX75-2FGG676C?
Yes. Related or alternative parts may be available on this page when relevant product data is provided.
What operating temperature range does XC6SLX75-2FGG676C support?
What is the standard lead time for XC6SLX75-2FGG676C?
What is the mounting type of XC6SLX75-2FGG676C?
What voltage specification is listed for XC6SLX75-2FGG676C?
Availability (In Stock : 183 )
Quantity Unit Price Ext. Price
1+ $181.89600 $181.90
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