AMD_XC6SLX75-3FG676C
original

AMD
XC6SLX75-3FG676C

696-XC6SLX75-3FG676C
IC FPGA 408 I/O 676FCBGA
12 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
3170304
Number of LABs/CLBs
5831
ECCN
3A991D
Number of I/O
408
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
676-FBGA (27x27)
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XC6SLX75-3FG676C Description

AMD's XC6SLX75-3FG676C is a high-performance Field Programmable Gate Array (FPGA) device that is designed for use in a wide range of applications, including embedded systems, communications, and industrial control systems.

Description:

The XC6SLX75-3FG676C is a member of the Spartan-6 family of FPGAs from AMD. It is a mid-range device that offers a good balance of performance, power efficiency, and cost. The device is available in a compact 676-ball Fine-Pitch Ball Grid Array (FBGA) package, making it suitable for use in a wide range of applications where space is at a premium.

Features:

Some of the key features of the XC6SLX75-3FG676C include:

  1. High-performance programmable logic: The device offers a high-density programmable logic fabric that can be configured to implement a wide range of digital logic functions.
  2. On-chip memory: The device includes a range of on-chip memory resources, including block RAM and distributed RAM, which can be used to store data and implement complex memory-intensive functions.
  3. Digital signal processing (DSP) capabilities: The device includes dedicated DSP blocks that can be used to implement high-speed mathematical operations, such as multiplication and accumulation.
  4. High-speed I/O: The device supports a wide range of high-speed I/O interfaces, including Gigabit Ethernet, PCI Express, and DDR memory interfaces.
  5. Security features: The device includes a range of security features, including encryption and authentication, to protect against unauthorized access and tampering.

Applications:

The XC6SLX75-3FG676C is suitable for use in a wide range of applications, including:

  1. Embedded systems: The device can be used in embedded systems where high performance and low power consumption are important, such as in industrial control systems, medical devices, and automotive systems.
  2. Communications: The device can be used in communications systems, such as network routers and switches, where high-speed data processing and packet handling are required.
  3. Video processing: The device can be used in video processing systems, such as video encoders and decoders, where high-speed image and video processing is required.
  4. Military and aerospace: The device can be used in military and aerospace applications where high reliability and ruggedness are required, such as in satellite communication systems and radar systems.

Overall, the XC6SLX75-3FG676C is a versatile FPGA device that offers a range of features and capabilities that make it suitable for use in a wide range of applications. Its high performance, low power consumption, and compact form factor make it an attractive choice for designers looking for a reliable and cost-effective solution for their FPGA needs.

FAQ

What package or case is XC6SLX75-3FG676C available in?
XC6SLX75-3FG676C is available in the 676-BGA package / case.
What is the mounting type of XC6SLX75-3FG676C?
What voltage specification is listed for XC6SLX75-3FG676C?
What operating temperature range does XC6SLX75-3FG676C support?
What is the standard lead time for XC6SLX75-3FG676C?
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