AMD_XC6SLX75-3FGG676I
original

AMD
XC6SLX75-3FGG676I

696-XC6SLX75-3FGG676I
IC FPGA 408 I/O 676FBGA
12 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
3170304
Number of LABs/CLBs
5831
ECCN
3A991D
Number of I/O
408
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
676-FBGA (27x27)
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XC6SLX75-3FGG676I Description

The XC6SLX75-3FGG676I is a field programmable gate array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device belongs to the Spartan-6 family of FPGAs, which are designed for a wide range of applications, including embedded systems, digital signal processing, and communications.

Description:

The XC6SLX75-3FGG676I is a high-performance, low-power FPGA that offers a balance between power consumption and functionality. It features a compact form factor and is available in a flip-chip ball grid array (FCBGA) package. The device has a total of 75,000 system gates and 1,200 input/output (I/O) pins, making it suitable for complex and high-density designs.

Features:

  1. High-density logic integration: The XC6SLX75-3FGG676I provides a high level of integration, allowing designers to implement complex logic functions on a single chip.
  2. Low power consumption: The device is designed to operate at low voltages, reducing power consumption and heat dissipation.
  3. Versatile I/O capabilities: With 1,200 I/O pins, the XC6SLX75-3FGG676I offers a wide range of connectivity options for various applications.
  4. High-performance clocking: The device supports high-performance clocking features, enabling designers to achieve high-speed data processing.
  5. On-chip memory: The FPGA includes block RAM and distributed RAM, providing ample memory resources for data storage and processing.
  6. Digital signal processing (DSP) capabilities: The XC6SLX75-3FGG676I features dedicated DSP slices, making it suitable for applications that require high-speed mathematical operations.
  7. Security features: The device includes security features such as encryption and authentication, ensuring the protection of sensitive data.

Applications:

The XC6SLX75-3FGG676I is suitable for a wide range of applications due to its high performance, low power consumption, and versatile I/O capabilities. Some potential applications include:

  1. Embedded systems: The device can be used in various embedded systems, such as automotive control units, industrial automation, and consumer electronics.
  2. Digital signal processing: The FPGA's DSP capabilities make it suitable for applications like audio and video processing, image and video compression, and communication systems.
  3. Communications: The XC6SLX75-3FGG676I can be used in communication systems, such as base stations, routers, and switches, due to its high-speed data processing capabilities.
  4. Networking: The device can be employed in networking applications, including Ethernet switches, network interface cards, and firewalls.
  5. Military and aerospace: The FPGA's robustness and reliability make it suitable for use in military and aerospace applications, such as radar systems, satellite communications, and navigation systems.
  6. Medical electronics: The XC6SLX75-3FGG676I can be used in medical electronics, such as imaging systems, patient monitoring devices, and diagnostic equipment.

In summary, the AMD XC6SLX75-3FGG676I is a versatile and high-performance FPGA that offers a range of features suitable for various applications. Its combination of logic integration, low power consumption, and I/O capabilities make it an attractive choice for designers working on complex and high-density projects.

FAQ

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XC6SLX75-3FGG676I is a FPGAs from AMD. This product page provides its main specifications, pricing information, availability, and inquiry options.
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