AMD_XC6SLX9-3FTG256C
original

AMD
XC6SLX9-3FTG256C

696-XC6SLX9-3FTG256C
IC FPGA 186 I/O 256FTBGA
12 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
589824
Number of LABs/CLBs
715
ECCN
EAR99
Number of I/O
186
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
256-FTBGA (17x17)
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XC6SLX9-3FTG256C Description

The XC6SLX9-3FTG256C is a field programmable gate array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device is part of the Spartan-6 series of FPGAs and is designed to provide high performance and low power consumption for a wide range of applications.

Description:

The XC6SLX9-3FTG256C is a mid-range FPGA that features a high-density of programmable logic resources, making it suitable for a variety of applications. It is available in a flip-chip ball grid array (FCBGA) package with a total of 1,152 I/O (input/output) pins. The device has a programmable logic array of 9,344 slices and a total of 216 digital signal processing (DSP) blocks.

Features:

Some of the key features of the XC6SLX9-3FTG256C include:

  1. High-density programmable logic resources: The device offers a high-density of programmable logic resources, making it suitable for complex applications that require a large number of gates.
  2. Low power consumption: The device is designed to operate at low power levels, making it ideal for applications that require low power consumption.
  3. High-speed transceivers: The device includes high-speed transceivers that support data rates up to 3.125 Gbps, making it suitable for high-speed communication applications.
  4. Integrated block RAM: The device includes a large amount of block RAM, which can be used to store data and reduce the need for external memory.
  5. Digital signal processing blocks: The device includes 216 DSP blocks, which can be used to perform complex mathematical operations and signal processing tasks.

Applications:

The XC6SLX9-3FTG256C is suitable for a wide range of applications, including:

  1. High-speed communication systems: The high-speed transceivers and low power consumption of the device make it ideal for high-speed communication systems, such as 5G base stations and optical transport networks.
  2. Image and video processing: The device's programmable logic resources and DSP blocks make it well-suited for image and video processing applications, such as video encoding and decoding, image recognition, and machine vision.
  3. Industrial control systems: The device's I/O capabilities and programmable logic resources make it suitable for industrial control systems, such as motor control and robotics.
  4. Aerospace and defense: The device's high reliability and radiation tolerance make it suitable for aerospace and defense applications, such as satellite communication systems and radar systems.
  5. Medical imaging: The device's programmable logic resources and DSP blocks make it well-suited for medical imaging applications, such as computed tomography (CT) and magnetic resonance imaging (MRI) systems.

Overall, the XC6SLX9-3FTG256C is a versatile FPGA device that offers high performance, low power consumption, and a wide range of features that make it suitable for a variety of applications.

FAQ

What package or case is XC6SLX9-3FTG256C available in?
XC6SLX9-3FTG256C is available in the 256-LBGA package / case.
Are there related or alternative parts for XC6SLX9-3FTG256C?
What is the mounting type of XC6SLX9-3FTG256C?
What operating temperature range does XC6SLX9-3FTG256C support?
What is the standard lead time for XC6SLX9-3FTG256C?
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