AMD
XC6SLX9-N3FTG256C

696-XC6SLX9-N3FTG256C
IC FPGA 186 I/O 256FTBGA
12 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
589824
Number of LABs/CLBs
715
ECCN
EAR99
Number of I/O
186
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
256-FTBGA (17x17)
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XC6SLX9-N3FTG256C Description

The XC6SLX9-N3FTG256C is a high-performance field programmable gate array (FPGA) from AMD (previously known as Xilinx). This device is part of the Spartan-6 family, which is known for its low power consumption, high integration, and excellent performance for a wide range of applications.

Description:

The XC6SLX9-N3FTG256C is a mid-range FPGA that combines a high-density of programmable logic resources with low power consumption and a small form factor. It is based on a 45nm technology node and features a comprehensive set of I/O and system-level functions, making it suitable for a wide range of applications.

Features:

  1. High-density programmable logic resources: The XC6SLX9-N3FTG256C offers a large number of programmable logic elements, including configurable logic blocks, digital signal processing blocks, and memory resources.
  2. Low power consumption: The device is designed to operate at low voltage levels, reducing power consumption and heat dissipation.
  3. Enhanced I/O capabilities: The FPGA features a wide range of I/O options, including high-speed transceivers, differential signaling, and versatile I/O standards.
  4. On-chip system-level functions: The XC6SLX9-N3FTG256C includes various system-level functions, such as clock management, power management, and security features.
  5. Robust design and reliability: The device is built using a 45nm technology node, ensuring high reliability and performance in various operating conditions.
  6. Versatile package options: The XC6SLX9-N3FTG256C is available in various package options, including flip-chip and fine-pitch ball grid array (FBGA) packages, to suit different board-level requirements.

Applications:

The XC6SLX9-N3FTG256C is suitable for a wide range of applications due to its high performance, low power consumption, and versatile features. Some of the key application areas include:

  1. Communications: The FPGA can be used in various communication systems, such as high-speed data transmission, wireless communication, and network infrastructure.
  2. Industrial control: The device can be employed in industrial automation and control systems, where real-time processing and deterministic behavior are crucial.
  3. Automotive: The XC6SLX9-N3FTG256C can be used in advanced driver assistance systems (ADAS), infotainment systems, and other automotive electronic control units (ECUs).
  4. Consumer electronics: The FPGA can be utilized in consumer devices, such as set-top boxes, gaming consoles, and smart home appliances.
  5. Aerospace and defense: The device can be employed in aerospace and defense applications, where high reliability, security, and performance are essential.
  6. Medical electronics: The XC6SLX9-N3FTG256C can be used in medical imaging systems, patient monitoring devices, and other medical equipment that require high-speed processing and low power consumption.

In summary, the AMD XC6SLX9-N3FTG256C is a versatile and powerful FPGA that offers a combination of high-density programmable logic resources, low power consumption, and a wide range of I/O and system-level functions. Its suitability for various applications makes it an excellent choice for designers looking for a reliable and high-performance solution.

FAQ

What is the standard lead time for XC6SLX9-N3FTG256C?
The standard lead time for XC6SLX9-N3FTG256C is 12 Weeks.
What is the mounting type of XC6SLX9-N3FTG256C?
What package or case is XC6SLX9-N3FTG256C available in?
What voltage specification is listed for XC6SLX9-N3FTG256C?
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