AMD_XC7S100-1FGGA676C
original

AMD
XC7S100-1FGGA676C

696-XC7S100-1FGGA676C
IC FPGA 400 I/O 676FPBGA
16 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
4423680
Number of LABs/CLBs
8000
ECCN
5A002A1
Number of I/O
400
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
676-FPBGA (27x27)
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XC7S100-1FGGA676C Description

XC7S100-1FGGA676C Overview

XC7S100-1FGGA676C has revolutionized the electronics industry and continues to drive innovation in many fields. The 1265106-XC7S100-1FGGA676C is an AMD Xilinx-designed integrated circuit that is part of the Spartan 7 series and comes in a Tray package. The standard package includes one unit and it is mounted using SMD (SMT) technology. With 400 I/Os, this component has 8000 LABs/CLBs, 102400 logic elements/cells, and a total RAM capacity of 4423680 bits. It requires a voltage supply of 0.95V to 1.05V and has a package/case of 676-BGA and a supplier device package of 676-FPBGA (27x27). The operating temperature range for this component is 0°C to 85°C (TJ), and it faces a fake threat in the open market of 67%.

XC7S100-1FGGA676C Features

Integrated memory blocks

Configuration options

Ecosystem and development tools

High-level design abstraction

Design security features

XC7S100-1FGGA676C Applications

Cloud Computing

Wireless Technology

Industrial Control

Internet of Things

FAQ

What package or case is XC7S100-1FGGA676C available in?
XC7S100-1FGGA676C is available in the 676-BGA package / case.
Does XC7S100-1FGGA676C have quantity-based pricing?
What operating temperature range does XC7S100-1FGGA676C support?
Is XC7S100-1FGGA676C currently in stock?
What is XC7S100-1FGGA676C?
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