AMD Tariff Inquiry

XC7S6-1CPGA196I

XC7S6-1CPGA196I Overview

Embedded FPGAs are a subset of integrated circuits, and the XC7S6-1CPGA196I is one among them. The device is packaged in a tray and has a typical package size of 1. It has 100 I/Os and a surface mount mounting. The system comprises 6000 logic components/cells and 184320 RAM bits in total. The voltage supply required by this device ranges from 0.95V to 1.05V. The device can function in a temperature range of -40°C to 100°C and is temperature resistant. The device has an MSL level of 3 and an ECCN of EAR99. Due to the device's great performance and dependability, it is frequently employed in numerous electronic applications.

XC7S6-1CPGA196I Features

Integrated block for PCI Express® (PCIe), for up to x8 Gen3

Endpoint and Root Port designs

Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.

Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.

XC7S6-1CPGA196I Applications

Internet of Things

Medical Equipment

Consumer Electronics

Aerospace & Defense

Telecommunication