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XC7S6-2FTGB196I

XC7S6-2FTGB196I Overview

AMD Xilinx manufactures the XC7S6-2FTGB196I electrical component. It is classified as integrated circuits (ICs)>embedded>FPGAs (Field Programmable Gate Array). It is packaged in a tray and comes in a regular package of 1. It has 100 I/Os and a surface mount. The XC7S6-2FTGB196I component contains 6000 logic elements/cells and 184320 RAM bits in total. It has a 0.95V 1.05V supply voltage and a 196-CSBGA (15x15) supplier device package. The working temperature range for this component is -40°C to 100°C (TJ). It complies with RoHS3 and has an ECCN of EAR99. This component has a false danger level of 65 and an MSL level of 3 (168 Hours). It has the HTSUS code 8542.39.0001 and the component number 122-2247.

XC7S6-2FTGB196I Features

Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip chip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.

XC7S6-2FTGB196I Applications

Enterprise networking

Software-defined radios

Solar Energy

Automotive Applications

Military Temperature