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XC7S75-L1FGGA676I

XC7S75-L1FGGA676I Overview

XC7S75-L1FGGA676I can be designed for high reliability, which is important for critical applications such as aerospace and defense. The 1323283-XC7S75-L1FGGA676I from AMD Xilinx is an FPGA IC that is packaged in a tray with a standard package of one. It has a surface mount mounting type and boasts 400 I/O, 6000 LABs/CLBs, and 76800 logic elements/cells. Additionally, it has a total RAM bit capacity of 4331520 and operates on a voltage supply of 0.92V ~ 0.98V. The device package is 676-FPBGA (27x27), and it can operate within a temperature range of -40°C to 100°C (TJ). This IC is compliant with ECCN: 5A002A1 standards and has a fake threat level of 75 in the open market. It also has an MSL level of 3 (168 Hours) and an HTSUS of 8542.39.0001. This IC is part of the XC7S75 series and is RoHS3 compliant.

XC7S75-L1FGGA676I Features

Configuration options

Ecosystem and development tools

High-level design abstraction

Design security features

IP cores and ecosystem

XC7S75-L1FGGA676I Applications

Cloud Computing

Wireless Technology

Industrial Control

Internet of Things

Medical Equipment