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XC7VX485T-1FFG1930I

XC7VX485T-1FFG1930I Overview

The XC7VX485T-1FFG1930I offers a substantial logic capacity of 485,000 logic cells. These cells serve as the building blocks for implementing complex digital designs. It features a flip-chip fine-pitch ball grid array (BGA) package with a 1FF footprint. This package type enables secure connections, efficient heat dissipation, and easy integration into electronic systems. The XC7VX485T-1FFG1930I operates within a specified temperature range, ensuring reliable performance across different environmental conditions. This FPGA is designed to deliver exceptional performance, making it suitable for applications that require high-speed data processing, complex algorithms, and real-time processing. The XC7VX485T-1FFG1930I offers extensive programmable logic flexibility, allowing users to configure and customize the FPGA to meet their specific application requirements.

XC7VX485T-1FFG1930I Features

Low-Power Optimization

High-Level Synthesis (HLS)

Heterogeneous System Integration

High-Speed Serial Connectivity

Advanced Debugging and Analysis Tools

XC7VX485T-1FFG1930I Applications

Military Temperature

Medical ultrasounds

Software-defined radio

Video & Image Processing

Aircraft navigation