AMD_XC7Z030-2FFG676E

AMD
XC7Z030-2FFG676E  
System On Chip (SoC)

AMD
XC7Z030-2FFG676E
777-XC7Z030-2FFG676E
IC SOC CORTEX-A9 800MHZ 676FCBGA
In Stock : 2

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XC7Z030-2FFG676E Description

The XC7Z030-2FFG676E is a Field Programmable Gate Array (FPGA) device manufactured by AMD (formerly Xilinx). It belongs to the Zynq-7000 series, which combines the capabilities of a general-purpose processor with the flexibility of an FPGA. Here's a description of the model, its features, and potential applications:

Model Description:

The XC7Z030-2FFG676E is a mid-range FPGA device that offers a balance between performance, power consumption, and cost. It is part of the Zynq-7000 series, which integrates a processing system (PS) with an FPGA fabric, allowing for a single-chip solution that can handle both processing and reconfigurable logic tasks.

Features:

  1. Integration: The device integrates a processing system (PS) with an FPGA fabric, allowing for a single-chip solution that can handle both processing and reconfigurable logic tasks.
  2. Processing System: It includes a dual-core processor, typically an ARM Cortex-A9, which provides general-purpose processing capabilities.
  3. FPGA Fabric: The FPGA fabric consists of configurable logic blocks (CLBs), digital signal processing blocks (DSPs), block RAM (BRAM), and other resources that can be programmed to implement custom digital logic.
  4. I/O: The device offers a variety of I/O options, including high-speed transceivers for communication and a range of general-purpose I/O (GPIO) for interfacing with external peripherals.
  5. Memory Interface: It supports high-bandwidth memory (HBM) interfaces, allowing for efficient data transfer between the PS and the FPGA fabric.
  6. Power Efficiency: Designed for low-power applications, the XC7Z030-2FFG676E is suitable for battery-powered or energy-sensitive systems.
  7. Package: The -2FFG676E suffix indicates a flip-chip ball grid array (FCBGA) package with 676 I/Os, which provides a high-density option for space-constrained applications.

Applications:

  1. Embedded Systems: Due to the integration of a processor and FPGA fabric, the XC7Z030-2FFG676E is well-suited for complex embedded systems that require both processing and custom logic.
  2. Industrial Automation: It can be used in control systems for industrial automation, where real-time processing and reconfigurable logic are essential.
  3. Medical Devices: The device's low power consumption and processing capabilities make it suitable for medical devices that require high reliability and low power budgets.
  4. Communication Systems: The high-speed transceivers and processing capabilities of the XC7Z030-2FFG676E make it suitable for communication systems, including base stations and routers.
  5. Video Processing: With its integrated processing system and configurable logic, the device can be used for video processing applications, such as image and signal processing.
  6. Aerospace and Defense: The device's flexibility and reliability make it suitable for aerospace and defense applications, where robustness and adaptability are critical.
  7. Automotive: The XC7Z030-2FFG676E can be used in advanced driver-assistance systems (ADAS) and other automotive applications that require a combination of processing and custom logic.

Please note that the specific features and capabilities of the XC7Z030-2FFG676E can vary depending on the exact configuration and implementation, and it's essential to consult the datasheet and technical documentation for detailed information.

Tech Specifications

Core Processor
Speed
Operating Temperature
Architecture
Flash Size
RAM Size
ECCN
Number of I/O
Peripherals
Product Status
Supplier Device Package
Series
Package / Case
REACH Status
Mfr
Connectivity
HTSUS
Package
RoHS Status
Primary Attributes
Base Product Number
Moisture Sensitivity Level (MSL)
Mounting Style
Unit Weight
Number of Logic Elements
Number of Logic Array Blocks - LABs
L1 Cache Instruction Memory
Embedded Memory
Adaptive Logic Modules - ALMs
RoHS
Minimum Operating Temperature
Tradename
L1 Cache Data Memory
Moisture Sensitive
Maximum Clock Frequency
Number of I/Os
Program Memory Size
Maximum Operating Temperature
USHTS
Data RAM Size
Number of Cores
Core

XC7Z030-2FFG676E Documents

Download datasheets and manufacturer documentation for XC7Z030-2FFG676E

Ersa Zynq-7000 Errata      
Ersa Zynq-7000 User Guide       XC7Z030,35,45,100 Datasheet       Zynq-7000 All Programmable SoC Overview      
Ersa Mult Dev Material Chg 16/Dec/2019       Cross-Ship Lead-Free Notice 31/Oct/2016      
Ersa Xilinx REACH211 Cert       Xiliinx RoHS Cert      

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