AMD_XC7Z030-L2FBG676I
original

AMD
XC7Z030-L2FBG676I

777-XC7Z030-L2FBG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed
800MHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
3A991D
Number of I/O
130
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XC7Z030-L2FBG676I Description

XC7Z030-L2FBG676I Description

The XC7Z030-L2FBG676I from AMD is a high-performance System-on-Chip (SoC) integrating a dual-core ARM Cortex-A9 MPCore processor running at 800MHz with a 28nm FPGA fabric, offering a versatile solution for embedded systems requiring both processing power and programmable logic. Packaged in a 676-pin FCBGA, this device combines 256KB of RAM, extensive I/O capabilities (130 pins), and rich connectivity options, making it ideal for complex, real-time applications. Compliant with ROHS3 and REACH Unaffected, it is designed for industrial, automotive, and communications environments where reliability and performance are critical.

XC7Z030-L2FBG676I Features

  • Dual-Core Cortex-A9 CPU: Delivers 800MHz processing for high-speed computation.
  • FPGA Integration: Combines MCU flexibility with FPGA reconfigurability for adaptive hardware acceleration.
  • Rich Connectivity: Supports CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, and EBI/EMI for seamless peripheral interfacing.
  • High I/O Count: 130 programmable I/Os enable extensive system expansion.
  • Low Latency DMA: Enhances data throughput for real-time processing.
  • Industrial Robustness: ECCN 3A991D certified, MSL3 (168 hours) moisture resistance, and wide-temperature operation support.
  • Power Efficiency: 28nm architecture balances performance with energy savings.

XC7Z030-L2FBG676I Applications

  • Industrial Automation: PLCs, motor control, and robotics leveraging FPGA real-time processing.
  • Embedded Vision: Camera interfaces, ADAS, and machine vision with high-speed I/O.
  • Communications Infrastructure: Gateway controllers, baseband processing, and protocol bridging.
  • Medical Devices: Portable diagnostics and imaging systems requiring low-latency data handling.
  • Aerospace & Defense: Ruggedized systems with secure connectivity and reconfigurable logic.

Conclusion of XC7Z030-L2FBG676I

The XC7Z030-L2FBG676I stands out as a highly integrated SoC merging FPGA adaptability with ARM processing power, suited for demanding embedded applications. Its rich peripheral set, industrial durability, and scalable architecture make it a superior choice over discrete MCU+FPGA solutions, reducing BOM complexity while enabling customization. Ideal for developers targeting real-time control, signal processing, or heterogeneous computing, this SoC delivers a future-proof platform for next-generation designs.

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