AMD_XC7Z035-1FBG676C
original

AMD
XC7Z035-1FBG676C

777-XC7Z035-1FBG676C
IC SOC CORTEX-A9 667MHZ 676FCBGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed
667MHz
Operating Temperature
0°C ~ 85°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
3A991D
Number of I/O
130
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XC7Z035-1FBG676C Description

The XC7Z035-1FBG676C is a Field Programmable Gate Array (FPGA) device manufactured by AMD (previously known as Xilinx). It belongs to the Zynq-7000 series, which combines the capabilities of a general-purpose processor with the flexibility of an FPGA. Here's a brief description, features, and applications of the XC7Z035-1FBG676C:

Description:

The XC7Z035-1FBG676C is a mid-range, low-power FPGA device designed for a wide range of applications that require both processing and programmable logic capabilities. It is part of the Zynq-7000 series, which integrates a processing system (PS) with an FPGA fabric, allowing developers to implement complex systems with a single device.

Features:

  1. Integration: Combines a processing system (PS) with an FPGA fabric, providing both processing and programmable logic capabilities.
  2. Processing System: The PS includes a single-core or dual-core processor, depending on the specific device, which can be an ARM Cortex-A9 or another compatible processor.
  3. FPGA Fabric: The programmable logic fabric consists of configurable logic blocks (CLBs), digital signal processing blocks (DSPs), block RAM (BRAM), and other resources for implementing custom logic functions.
  4. I/O: Offers a variety of I/O options, including high-speed transceivers, GPIOs, and other specialized interfaces.
  5. Power Efficiency: Designed for low-power applications, making it suitable for battery-powered or energy-sensitive systems.
  6. Package: The 1FBG676C package is a flip-chip ball grid array (FCBGA) with 676 I/Os, providing a compact form factor for high-density applications.
  7. Operating Temperature: It typically supports a commercial (0°C to 70°C) or industrial (-40°C to 85°C) temperature range, depending on the specific device.

Applications:

  1. Industrial Automation: Used in programmable logic controllers (PLCs), motor control, and sensor integration for automation systems.
  2. Medical Devices: Employed in portable or wearable medical devices, such as monitoring equipment, diagnostic tools, and imaging systems.
  3. Automotive: Suitable for in-vehicle infotainment systems, advanced driver-assistance systems (ADAS), and other automotive electronics.
  4. Consumer Electronics: Utilized in smart home devices, IoT devices, and other consumer electronics requiring both processing and programmable logic capabilities.
  5. Communications: Used in networking equipment, base stations, and other communication systems that require flexible and programmable hardware.
  6. Aerospace and Defense: Employed in secure communication systems, radar processing, and other defense-related electronics.

The XC7Z035-1FBG676C is a versatile FPGA device that can be used in a wide range of applications, thanks to its integration of processing capabilities and programmable logic. It is particularly well-suited for applications requiring low power consumption and a compact form factor.

FAQ

What is XC7Z035-1FBG676C?
XC7Z035-1FBG676C is a System On Chip (SoC) from AMD. This product page provides its main specifications, pricing information, availability, and inquiry options.
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Availability (In Stock : 6 )
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