AMD_XC7Z035-1FFG900I
original

AMD
XC7Z035-1FFG900I

777-XC7Z035-1FFG900I
IC SOC CORTEX-A9 667MHZ 900FCBGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed
667MHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
3A991D
Number of I/O
130
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XC7Z035-1FFG900I Description

The XC7Z035-1FFG900I is a Field Programmable Gate Array (FPGA) device manufactured by AMD (now part of Xilinx, after Xilinx's acquisition of AMD's programmable logic business). This particular model belongs to the Zynq-7000 series, which combines the capabilities of a general-purpose processor with the flexibility of an FPGA. Here's a brief description, features, and potential applications for the XC7Z035-1FFG900I:

Description:

The XC7Z035-1FFG900I is a mid-range FPGA device that integrates a processing system (PS) with an FPGA fabric. It is designed to provide a balance between processing power, power consumption, and cost, making it suitable for a wide range of applications that require both processing and programmable logic capabilities.

Features:

  1. Dual-core Processor: The device features a dual-core processor based on the ARM Cortex-A9 architecture, providing processing power for general-purpose computing tasks.
  2. FPGA Fabric: The FPGA fabric consists of programmable logic resources, including Look-Up Tables (LUTs), flip-flops, and digital signal processing (DSP) blocks, allowing for custom hardware acceleration and parallel processing.
  3. Memory Interface: The XC7Z035-1FFG900I includes a memory controller that supports DDR3/DDR3L memory, enabling high-speed data access for both the processor and the FPGA fabric.
  4. I/O Capabilities: The device offers a variety of I/O options, including PCIe, Gigabit Ethernet, USB, and other serial and parallel interfaces, allowing for easy integration with external peripherals and communication protocols.
  5. Power Management: The FPGA includes power management features to optimize power consumption, making it suitable for applications with power constraints.
  6. Security Features: The device provides security features such as encryption and authentication to protect sensitive data and intellectual property.
  7. Package Type: The "1FFG900I" in the model number indicates a flip-chip ball grid array (FCBGA) package with 900 I/Os, which is suitable for applications requiring a high-density interconnect.

Applications:

The XC7Z035-1FFG900I is well-suited for a variety of applications that require both processing and custom hardware acceleration. Some potential applications include:

  1. Embedded Systems: Acting as the central processing unit for complex embedded systems that require real-time processing and hardware acceleration.
  2. Industrial Automation: Implementing custom control algorithms and interfacing with various sensors and actuators in industrial automation systems.
  3. Video Processing: Accelerating video processing tasks such as encoding, decoding, and image recognition in surveillance or multimedia applications.
  4. Medical Devices: Providing the processing power and custom hardware acceleration needed for medical imaging and signal processing in medical devices.
  5. Communication Systems: Implementing custom communication protocols and performing data processing in networking equipment and communication systems.
  6. Automotive: Enabling advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems with the required processing and programmable logic capabilities.

The XC7Z035-1FFG900I's combination of processing power and FPGA fabric makes it a versatile device for a wide range of applications that require both general-purpose computing and custom hardware acceleration.

FAQ

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The standard lead time for XC7Z035-1FFG900I is 16 Weeks.
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