AMD_XCKU085-1FLVB1760C
original

AMD
XCKU085-1FLVB1760C

696-XCKU085-1FLVB1760C
IC FPGA 676 I/O 1760FCBGA
20 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
58265600
Number of LABs/CLBs
62190
ECCN
3A001A7B
Number of I/O
676
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
1760-FCBGA (42.5x42.5)
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XCKU085-1FLVB1760C Description

AMD's XCKU085-1FLVB1760C is a high-performance integrated circuit (IC) designed for use in a variety of applications. This IC is part of AMD's Ryzen series, which is known for its high performance and energy efficiency.

Description:

The XCKU085-1FLVB1760C is a 7-nanometer (nm) process technology IC that features a high-performance CPU and GPU on a single chip. It is designed to provide exceptional performance and power efficiency for a wide range of applications.

Features:

Some of the key features of the XCKU085-1FLVB1760C include:

  1. High-performance CPU and GPU: The XCKU085-1FLVB1760C features a high-performance CPU and GPU on a single chip, providing exceptional performance for a wide range of applications.
  2. 7nm process technology: The IC is built using a 7nm process technology, which allows for higher performance and lower power consumption compared to older process technologies.
  3. Advanced power management: The XCKU085-1FLVB1760C features advanced power management techniques, allowing it to operate efficiently and effectively in a variety of environments.
  4. High-speed data transfer: The IC supports high-speed data transfer rates, making it ideal for use in applications that require fast data processing and transfer.
  5. Compact form factor: The XCKU085-1FLVB1760C has a compact form factor, making it suitable for use in a variety of applications where space is at a premium.

Applications:

The XCKU085-1FLVB1760C is suitable for use in a wide range of applications, including:

  1. Gaming: The high-performance CPU and GPU make the XCKU085-1FLVB1760C ideal for use in gaming applications, providing smooth and responsive gameplay.
  2. Artificial intelligence (AI) and machine learning: The advanced processing capabilities of the XCKU085-1FLVB1760C make it well-suited for use in AI and machine learning applications, where high-performance computing is required.
  3. High-performance computing (HPC): The XCKU085-1FLVB1760C is ideal for use in HPC applications, where high-performance computing is required for tasks such as scientific research and data analysis.
  4. Embedded systems: The compact form factor and advanced power management features of the XCKU085-1FLVB1760C make it suitable for use in embedded systems, where space and power efficiency are important considerations.
  5. Consumer electronics: The XCKU085-1FLVB1760C can be used in a variety of consumer electronics applications, such as smartphones, tablets, and laptops, providing high-performance computing capabilities in a compact and efficient package.

FAQ

What package or case is XCKU085-1FLVB1760C available in?
XCKU085-1FLVB1760C is available in the 1760-BBGA, FCBGA package / case.
Are there related or alternative parts for XCKU085-1FLVB1760C?
What is the mounting type of XCKU085-1FLVB1760C?
What voltage specification is listed for XCKU085-1FLVB1760C?
Does XCKU085-1FLVB1760C have quantity-based pricing?
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